Patents by Inventor Aya Fujii

Aya Fujii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof
    Publication number: 20100025089
    Abstract: A circuit member connection structure 10 according to the invention is provided with circuit members 20,30 having a plurality of circuit electrodes 22,32 formed on the main surfaces 21a,31a of circuit boards 21,31. A circuit connecting member 60 which connects together the circuit members 20,30 with the circuit electrodes 22,32 opposing each other is comprising a cured circuit connecting material of the invention. The circuit connecting material of the invention comprises an adhesive composition and covered particles 50 comprising conductive particles 51 with portions of their surfaces 51a covered by insulating fine particles 52, wherein the mass of the insulating fine particles 52 constitutes 2/1000 to 26/1000 of the mass of the conductive particles 51.
    Type: Application
    Filed: January 1, 2005
    Publication date: February 4, 2010
    Inventors: Jun Taketatsu, Itsuo Watanabe, Yasushi Gotou, Kazuo Yamaguchi, Masaki Fujii, Aya Fujii