Patents by Inventor Aya IKEDA

Aya IKEDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element
    Patent number: 10808150
    Abstract: A resin composition comprising (a) an acrylic polymer, (b) a compound having at least one (meth)acryloyl group and (c) a polymerization initiator, in which the absolute value of refractive index difference between the component (a) an acrylic polymer and the component (b) having at least one (meth)acryloyl group at 100° C. is 0.031 or less.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: October 20, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Sadaaki Kato, Mika Kimura, Aya Ikeda, Shinjiro Fujii
  • CURABLE COMPOSITION FOR FORMING ELASTIC RESIN LAYER
    Publication number: 20190241694
    Abstract: Disclosed is a curable composition for forming a stretchable resin layer, containing: (A) an elastomer having a polystyrene chain; (B) monofunctional straight-chain alkyl (meth)acrylate; (C) monofunctional (meth)acrylate having an alicyclic group; (D) a difunctional or higher compound having two or more ethylenically unsaturated groups; and (E) a polymerization initiator.
    Type: Application
    Filed: October 25, 2017
    Publication date: August 8, 2019
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Tomoaki SHIBATA, Satoshi UEHARA, Aya IKEDA, Shunsuke OTAKE, Tomonori MINEGISHI, Kazuyoshi TENDOU
  • Adhesive composition, resin cured product obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element
    Patent number: 10358580
    Abstract: An adhesive composition comprising (a) a compound having at least two ethylenically unsaturated groups, (b) a thermal polymerization initiator, (c) a hindered phenolic compound, (d) a thioether compound and (e) a compound having a thiol group.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: July 23, 2019
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Aya Ikeda, Shinjiro Fujii, Sadaaki Katou, Syougo Kikuchi, Shu Hashimoto
  • RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING RESIN COMPOSITION, AND SOLID-STATE IMAGING ELEMENT
    Publication number: 20180208807
    Abstract: A resin composition comprising (a) an acrylic polymer, (b) a compound having at least one (meth)acryloyl group and (c) a polymerization initiator, in which the absolute value of refractive index difference between the component (a) an acrylic polymer and the component (b) having at least one (meth)acryloyl group at 100° C. is 0.031 or less.
    Type: Application
    Filed: March 20, 2018
    Publication date: July 26, 2018
    Inventors: Sadaaki KATOU, Mika KIMURA, Aya IKEDA, Shinjiro FUJII
  • Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element
    Patent number: 9920227
    Abstract: A resin composition comprising (a) an acrylic polymer, (b) a compound having at least one (meth)acryloyl group and (c) a polymerization initiator, in which the absolute value of refractive index difference between the component (a) an acrylic polymer and the component (b) having at least one (meth)acryloyl group at 100° C. is 0.031 or less.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: March 20, 2018
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Sadaaki Katou, Mika Kimura, Aya Ikeda, Shinjiro Fujii
  • Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element
    Patent number: 9868884
    Abstract: An adhesive composition comprising (a) an acrylic polymer having a weight-average molecular weight of 100000 or more, (b) a compound having at least two (meth)acryloyl groups and (c) a polymerization initiator, in which a structural unit having a nitrogen atom-containing group in the (a) acrylic polymer having a weight-average molecular weight of 100000 or more accounts for 5 mass % or less based on the total amount of the (a) acrylic polymer having a weight-average molecular weight of 100000 or more; and the (a) acrylic polymer having a weight-average molecular weight of 100000 or more has a structural unit having a functional group.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: January 16, 2018
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Aya Ikeda, Sadaaki Katou, Shinjiro Fujii, Syougo Kikuchi, Shu Hashimoto
  • RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING RESIN COMPOSITION, AND SOLID-STATE IMAGING ELEMENT
    Publication number: 20160355709
    Abstract: A resin composition comprising (a) an acrylic polymer, (b) a compound having at least one (meth)acryloyl group and (c) a polymerization initiator, in which the absolute value of refractive index difference between the component (a) an acrylic polymer and the component (b) having at least one (meth)acryloyl group at 100° C. is 0.031 or less.
    Type: Application
    Filed: January 29, 2015
    Publication date: December 8, 2016
    Inventors: Sadaaki KATOU, Mika KIMURA, Aya IKEDA, Shinjiro FUJII
  • ADHESIVE COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING ADHESIVE COMPOSITION, AND SOLID-STATE IMAGING ELEMENT
    Publication number: 20160340561
    Abstract: An adhesive composition comprising (a) an acrylic polymer having a weight-average molecular weight of 100000 or more, (b) a compound having at least two (meth)acryloyl groups and (c) a polymerization initiator, in which a structural unit having a nitrogen atom-containing group in the (a) acrylic polymer having a weight-average molecular weight of 100000 or more accounts for 5 mass % or less based on the total amount of the (a) acrylic polymer having a weight-average molecular weight of 100000 or more; and the (a) acrylic polymer having a weight-average molecular weight of 100000 or more has a structural unit having a functional group.
    Type: Application
    Filed: January 29, 2015
    Publication date: November 24, 2016
    Inventors: Aya Ikeda, Sadaaki Katou, Shinjiro Fujii, Syougo Kikuchi, Shu Hashimoto
  • ADHESIVE COMPOSITION, RESIN CURED PRODUCT OBTAINED FROM ADHESIVE COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING ADHESIVE COMPOSITION, AND SOLID-STATE IMAGING ELEMENT
    Publication number: 20160340554
    Abstract: An adhesive composition comprising (a) a compound having at least two ethylenically unsaturated groups, (b) a thermal polymerization initiator, (c) a hindered phenolic compound, (d) a thioether compound and (e) a compound having a thiol group.
    Type: Application
    Filed: January 29, 2015
    Publication date: November 24, 2016
    Inventors: Aya IKEDA, Shinjiro FUJII, Sadaaki KATOU, Syougo KIKUCHI, Shu HASHIMOTO
  • METHOD FOR MANUFACTURING ADHESION BODY, METHOD FOR MANUFACTURING SUBSTRATE WITH ADHESIVE PATTERN, AND SUBSTRATE WITH ADHESIVE PATTERN
    Publication number: 20120202015
    Abstract: The method for manufacturing an adhesion body according to the present invention is a method for manufacturing an adhesion body in which a first adherend and a second adherend are bonded to each other via an adhesive pattern, comprising a step of providing an adhesive layer containing a thermosetting component on a first adherend; a step of forming an adhesive pattern by etching the adhesive layer in a state in which a protective layer for protecting a predetermined portion of the adhesive layer from etching is provided on a surface of the adhesive layer opposite to a surface in contact with the first adherend; and a step of bonding a second adherend to the adhesive pattern after the protective layer is removed.
    Type: Application
    Filed: February 3, 2012
    Publication date: August 9, 2012
    Inventors: Aya IKEDA, Shinjiro Fujii, Takashi Kawamori, Takashi Masuko