Abstract: According to one embodiment, a semiconductor device includes first to third electrodes, a semiconductor member, a first conductive member, first and second insulating members, and a first nitride member. A position of the third electrode in a first direction from the first to second electrodes is between positions of the first and second electrodes in the first direction. The semiconductor member includes first and second semiconductor regions. The first semiconductor region includes first to fifth partial regions. The second semiconductor region includes first and second semiconductor portions. The second semiconductor portion includes first and second portions, and a third portion between the first and second portions. The first conductive member includes first and second conductive regions. The first insulating member includes a first insulating region. The second insulating member includes first and second insulating portions. The first nitride member includes a first nitride region.

Abstract: According to one embodiment, a semiconductor device includes a first electrode, a second electrode, a third electrode, a first semiconductor member, a second semiconductor member, a first compound member, and a first insulating member. The third electrode includes a first electrode portion. The first semiconductor member includes Alx1Ga1-x1N (0?x1<1). The first semiconductor member includes first to seventh partial regions. The second semiconductor member includes Alx2Ga1-x2N (0<x2?1, x1<x2). The second semiconductor member includes first and second semiconductor portions. The first compound member includes Alz1Ga1-z1N (0<z1?1, x2<z1). The first compound member includes first to fifth regions. The first insulating member includes first and second insulating portions. At least a part of the first insulating portion and at least a part of the second insulating portion is amorphous.

Abstract: A semiconductor device includes first to third electrodes, a semiconductor member, first and second insulating members, a compound member, and a nitride member. The third electrode is between the first and second electrodes. The semiconductor member includes first and second semiconductor regions. The first semiconductor region includes first to fifth partial regions. The second semiconductor region includes first and second semiconductor portions. The first insulating member includes first and second insulating portions. The first semiconductor portion is between the fourth partial region and the first insulating portion. The second semiconductor portion is between the fifth partial region and the second insulating portion. The compound member includes first to third compound portions. The nitride member includes first to third nitride portions. The second insulating member includes first and second insulating regions.

Abstract: Provided are a solid food and a solid milk which have a suitable adhesive force and strength adequate to resist breakage during handling. The solid food is a solid food having a solid form obtained by compression molding a food powder, the solid food containing monohydrate crystals and anhydride crystals, in which an increase ratio ?/(?+?) of a crystallization rate of an increase ? (% by weight) in crystallization rate that is a difference of a ratio of the anhydride crystals with respect to a total weight on a surface of the solid food relative to a ratio of the anhydride crystals in an inner part of the solid food to the sum (?+?) of an increase ? (% by weight) in crystallization rate that is a difference of a ratio of the monohydrate crystals with respect to the total weight on the surface of the solid food relative to a ratio of the monohydrate crystals in the inner part of the solid food and the increase ? (% by weight) in crystallization rate is 0.

Abstract: Provided are a solid food and a solid milk which have suitable solubility and strength adequate to resist breakage during handling. The solid food is a solid food having a solid form obtained by compression molding a food powder, in which an increase Ya (% by weight) in total crystallization rate that is a difference of a crystal ratio with respect to a total weight at a depth Xa (mm) from a surface of the solid food relative to a crystal ratio in an inner part of the solid food satisfies the following Formula (1A), Ya<?5.24Xa+6.

Abstract: Provided are a solid food and a solid milk which have suitable solubility and strength adequate to resist breakage during handling. The solid food is a solid food having a solid form obtained by compression molding a food powder, in which a depth from a surface of the solid food at which an increase in total crystallization rate is zero or minimal is 1.1 mm or less, the increase in total crystallization rate being a difference of a crystal ratio with respect to a total weight at each depth from the surface of the solid food relative to a crystal ratio in an inner part of the solid food.

Abstract: Provided are a solid food and a solid milk which have suitable solubility and strength adequate to resist breakage during handling. The solid food is a solid food having a solid form obtained by compression molding a food powder, in which an increase in total crystallization rate that is a difference of a crystal ratio with respect to a total weight on a surface of the solid food relative to a crystal ratio in an inner part of the solid food is 0.1% by weight or less. Further, a depth from the surface of the solid food at which the increase in total crystallization rate is zero or minimal is 0.2 mm or less.

Abstract: Provided is a solid milk containing suitable free fat and having strength adequate to resist breakage during handling. The solid milk is a solid milk having a solid form obtained by compression molding a powdered milk, in which a hardening index IF represented by the following Formula (1) when the solid milk is divided into a plurality of pieces (N pieces) in a height direction is 0.477 mm2 or more, Formula (1) being represented by a width w in a target region n, a thickness ? in the target region n, a specific surface area voxel ratio Svvoxel_n in the target region n, a content R0 of a total milk sugar, and a total crystal amount Rn of a milk sugar in the target region n, and a content ratio FF of free fat in the solid milk is 1.23% by weight or less. [ Math .

Abstract: A solid food is a solid food having a solid form obtained by compression-molding a powder, the solid food including a body having a first face and a second face facing each other back to back. The body is provided with at least one hole penetrating the body from the first face to reach to the second face, and each of the first face, the second face, and an inner surface of the hole is an outer surface harder than an inner part of the body.

Abstract: A solid food is a solid food having a solid form obtained by compression molding a powder, in which in a case where a drop test in which the solid food is dropped onto a drop face is repeated until the solid food is broken, the number of times of dropping leading to breakage when a dropping energy density per unit fracture stress EF is 2×10?4 [(J/m2)/(N/m2)] is 3 times or more, the number of times of dropping leading to breakage when EF is 1×10?4 [(J/m2)/(N/m2)] is 10 times or more, and the number of times of dropping leading to breakage when EF is 5×10?5 [(J/m2)/(N/m2)] is more than 30 times, EF being obtained by dividing a dropping energy density in the drop test by a fracture stress of the solid food.

Abstract: A method for producing a solid food having a solid form obtained by compression molding a food powder includes: compression molding the food powder to form a compression molded body of the food powder; and performing a hardening treatment on the compression molded body of the food powder, in which the hardening treatment includes placing the compression molded body of the food powder under an environment of a humidity of 100% RH or less and a temperature of higher than 100° C.

Abstract: A solid food has a solid form obtained by compression molding a powder. Where a dissolution process from the solid food starting to dissolve until completely dissolving is measured over time on the basis of electric conductivity, times at which a dissolution ratio where electric conductivity at the time of finish of dissolution is 100%, reaches 20%, 63%, and 95% are t20, t63, and t95, and times (sec) at which the dissolution ratio of a reference solid food, formed under conditions in which a difference in weight with the solid food is within ±0.3%, a difference in surface area is within ±2%, a difference in hardness is within ±4%, and a humidification treatment temperature is 100° C. or lower, reaches 20%, 63%, and 95% are t20ref, t63ref, and t95ref, a solubility index (Id) represented by the following Formula (1) is less than 1.

Abstract: A numerical controller includes an analysis unit to analyze a machining program and extract a coordinate rotation angle that is a rotation angle of a coordinate system specified in the machining program; and a coordinate transformation unit to transform a coordinate value in the machining program into a coordinate value in a machine tool to be controlled on the basis of polarity information created on the basis of at least one of a movement direction and a rotation direction of an axis of the machine tool, and the coordinate rotation angle.

Abstract: Provided is an agent for reducing odors of pyrazine derivatives based on an olfactory receptor antagonism. The agent for reducing odors of pyrazine derivatives includes at least one antagonist of olfactory receptor OR5K1 as an active ingredient.

Abstract: Provided is an agent for reducing odors of pyrazine derivatives based on an olfactory receptor antagonism. The agent for reducing odors of pyrazine derivatives includes at least one antagonist of olfactory receptor OR5K1 as an active ingredient.