Abstract: In an ultraviolet light emitting device, a fluororesin layer includes an element covering portion that covers a second surface of an ultraviolet light emitting element, and a substrate covering portion that covers a mounting surface of a substrate. The substrate covering portion includes a flat portion having a flat surface. A distance from a point in the element covering portion farthest from the second surface of the ultraviolet light emitting element to the second surface of the ultraviolet light emitting element is 1.3 times or more and 5 times or less a distance from the flat surface of the flat portion of the substrate covering portion to the mounting surface of the substrate.

Abstract: An ultraviolet light emitting device includes a substrate, an ultraviolet light emitting element, a bonding layer, a fluororesin film, and a fluorocarbon compound. The substrate includes a mounting surface. The ultraviolet light emitting element includes a first surface, a second surface, and a side surface. The bonding layer bonds the electrode on the first surface of the ultraviolet light emitting element and a part of the mounting surface of the substrate. The fluororesin film is a flexible material configured to transmit ultraviolet light. The substrate and the fluororesin film are disposed in a state where the ultraviolet light emitting element is sandwiched therebetween. The fluorocarbon compound is a liquid at normal temperature and pressure. The fluorocarbon compound fills a gap between the side surface of the ultraviolet light emitting element and the fluororesin film in a state of being in contact with the side surface and the fluororesin film.

Abstract: The bonding layer bonds the electrode on the first surface of the ultraviolet light emitting element and a part of the mounting surface of the substrate. The adhesive layer adheres the substrate to the light transmitting member. The substrate and the light transmitting member are disposed in a state where the ultraviolet light emitting element is sandwiched therebetween. The fluorocarbon compound is a liquid at normal temperature and pressure. The fluorocarbon compound fills a gap between the second surface of the ultraviolet light emitting element and the light transmitting member in a state of being in contact with the second surface and the light transmitting member. The fluorocarbon compound is in contact with the side surface of the ultraviolet light emitting element. The fluorocarbon compound is not in contact with the adhesive layer.

Abstract: A method of manufacturing a light emitting element includes forming a resin film including a phosphor containing layer on a transparent board side surface of a wafer including a transparent board and a plurality of light emitting parts formed on the transparent board, forming a scribing line along a scheduled separation surface in a surface of the transparent board by scribing before or after forming the resin film, cutting the resin film along the scheduled separation surface before or after forming the scribing line, and separating the transparent board along the scheduled separation surface by breaking after forming the scribing line and cutting the resin film.

Abstract: A method of manufacturing a light emitting device, includes: temporarily connecting light emitting elements to a wiring layer through connection members, the wiring layer being formed on a mounting board provided with reflectors; contacting a pressing surface of a press-bonding jig with upper surfaces of the light emitting elements and pressing the light emitting elements toward the mounting board while being heated at the same time to deform the connection members and to contact the pressing surface with tops of the reflectors; and connecting the light emitting elements to the wiring layer in a flip chip manner, wherein when the light emitting elements are temporarily connected to the wiring layer, a sum of height of a light emitting element of the light emitting elements and a connection member of the connection members is set to be larger than a height of a reflector of the reflectors.

Abstract: A light source includes: a mounting substrate; and a side-view type light-emitting device including: a substrate; through holes; a front electrode; a rear electrode; side electrodes; and a light-emitting element, wherein: land patterns are formed on a front surface of the mounting substrate, in positions corresponding to the through holes, each land pattern having an inverted “T” shape composed of a narrow region and a wide region; the light-emitting device is arranged such that the cross sectional shape of the through hole in the long side direction of the substrate is aligned with the shape of the narrow region of the land pattern, in a plan view; and solder members are formed in a wall shape on the mounting substrate, are formed in the through holes on the mounting substrate, and connects the rear electrode and the side electrode to the wide region and the narrow region, respectively.

Abstract: A light source includes: a mounting substrate; and a side-view type light-emitting device including: a substrate; through holes; a front electrode; a rear electrode; side electrodes; and a light-emitting element, wherein: land patterns are formed on a front surface of the mounting substrate, in positions corresponding to the through holes, each land pattern having an inverted “T” shape composed of a narrow region and a wide region; the light-emitting device is arranged such that the cross sectional shape of the through hole in the long side direction of the substrate is aligned with the shape of the narrow region of the land pattern, in a plan view; and solder members are formed in a wall shape on the mounting substrate, are formed in the through holes on the mounting substrate, and connects the rear electrode and the side electrode to the wide region and the narrow region, respectively.

Abstract: A method of manufacturing a light emitting element includes forming a resin film including a phosphor containing layer on a transparent board side surface of a wafer including a transparent board and a plurality of light emitting parts formed on the transparent board, forming a scribing line along a scheduled separation surface in a surface of the transparent board by scribing before or after forming the resin film, cutting the resin film along the scheduled separation surface before or after forming the scribing line, and separating the transparent board along the scheduled separation surface by breaking after forming the scribing line and cutting the resin film.

Abstract: A method of manufacturing a light emitting device, includes: temporarily connecting light emitting elements to a wiring layer through connection members, the wiring layer being formed on a mounting board provided with reflectors; contacting a pressing surface of a press-bonding jig with upper surfaces of the light emitting elements and pressing the light emitting elements toward the mounting board while being heated at the same time to deform the connection members and to contact the pressing surface with tops of the reflectors; and connecting the light emitting elements to the wiring layer in a flip chip manner, wherein when the light emitting elements are temporarily connected to the wiring layer, a sum of height of a light emitting element of the light emitting elements and a connection member of the connection members is set to be larger than a height of a reflector of the reflectors.

Abstract: A light-emitting device includes a plurality of light-emitting elements face-down mounted on a substrate, a plurality of structures each including a transparent plate, a phosphor-containing film provided on a lower surface of the transparent plate and a transparent covering layer provided on the lower surface of the transparent plate so as to cover lower and side surfaces of the phosphor-containing film, the structures being each provided on each of the plurality of light-emitting elements such that a lower surface of the transparent covering layer contacts a top surface of the plurality of light-emitting elements, and a white reflector to cover a side surface of the plurality of light-emitting elements and a side surfaces of the transparent covering layer. At least a portion of a region directly above a gap between the plurality of light-emitting elements is not covered with the phosphor-containing film.

Abstract: A light-emitting device includes a plurality of light-emitting elements face-down mounted on a substrate, a plurality of structures each including a transparent plate, a phosphor-containing film provided on a lower surface of the transparent plate and a transparent covering layer provided on the lower surface of the transparent plate so as to cover lower and side surfaces of the phosphor-containing film, the structures being each provided on each of the plurality of light-emitting elements such that a lower surface of the transparent covering layer contacts a top surface of the plurality of light-emitting elements, and a white reflector to cover a side surface of the plurality of light-emitting elements and a side surfaces of the transparent covering layer. At least a portion of a region directly above a gap between the plurality of light-emitting elements is not covered with the phosphor-containing film.