Patents by Inventor Aya Muto

Aya Muto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Joining method and semiconductor device manufacturing method
    Patent number: 9087778
    Abstract: A joining method that allows joining processing to be carried out simultaneously at a plurality of portions without being influenced by a supply time restriction on a joining material, and a semiconductor device manufacturing method using the joining method are provided. A chip and a lead frame are tentatively assembled having a solid solder block interposed therebetween. The solder block is provided with protruding parts that protrude in one direction. The protruding parts are inserted into solder supply ports of the lead frame, whereby the chip and the lead frame are tentatively assembled. Subsequently, the chip and the lead frame are fed into a reflow oven, and the solder block is melted and thereafter solidified. Thus, the chip and the lead frame are joined to each other.
    Type: Grant
    Filed: April 11, 2014
    Date of Patent: July 21, 2015
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Aya Muto, Masayoshi Shinkai
  • JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
    Publication number: 20140217156
    Abstract: A joining method that allows joining processing to be carried out simultaneously at a plurality of portions without being influenced by a supply time restriction on a joining material, and a semiconductor device manufacturing method using the joining method are provided. A chip and a lead frame are tentatively assembled having a solid solder block interposed therebetween. The solder block is provided with protruding parts that protrude in one direction. The protruding parts are inserted into solder supply ports of the lead frame, whereby the chip and the lead frame are tentatively assembled. Subsequently, the chip and the lead frame are fed into a reflow oven, and the solder block is melted and thereafter solidified. Thus, the chip and the lead frame are joined to each other.
    Type: Application
    Filed: April 11, 2014
    Publication date: August 7, 2014
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Aya MUTO, Masayoshi Shinkai
  • Joining method and semiconductor device manufacturing method
    Patent number: 8746538
    Abstract: A joining method that allows joining processing to be carried out simultaneously at a plurality of portions without being influenced by a supply time restriction on a joining material, and a semiconductor device manufacturing method using the joining method are provided. A chip and a lead frame are tentatively assembled having a solid solder block interposed therebetween. The solder block is provided with protruding parts that protrude in one direction. The protruding parts are inserted into solder supply ports of the lead frame, whereby the chip and the lead frame are tentatively assembled. Subsequently, the chip and the lead frame are fed into a reflow oven, and the solder block is melted and thereafter solidified. Thus, the chip and the lead frame are joined to each other.
    Type: Grant
    Filed: October 19, 2012
    Date of Patent: June 10, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Aya Muto, Masayoshi Shinkai
  • JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
    Publication number: 20130134210
    Abstract: A joining method that allows joining processing to be carried out simultaneously at a plurality of portions without being influenced by a supply time restriction on a joining material, and a semiconductor device manufacturing method using the joining method are provided. A chip and a lead frame are tentatively assembled having a solid solder block interposed therebetween. The solder block is provided with protruding parts that protrude in one direction. The protruding parts are inserted into solder supply ports of the lead frame, whereby the chip and the lead frame are tentatively assembled. Subsequently, the chip and the lead frame are fed into a reflow oven, and the solder block is melted and thereafter solidified. Thus, the chip and the lead frame are joined to each other.
    Type: Application
    Filed: October 19, 2012
    Publication date: May 30, 2013
    Inventors: Aya Muto, Masayoshi Shinkai