Abstract: In a Cr—Cu alloy that is formed by powder metallurgy and contains a Cu matrix and flattened Cr phases, the Cr content in the Cr—Cu alloy is more than 30% to 80% or less by mass, and the average aspect ratio of the flattened Cr phases is more than 1.0 and less than 100. The Cr—Cu alloy has a small thermal expansion coefficient in in-plane directions, a high thermal conductivity, and excellent processibility. A method for producing the Cr—Cu alloy is also provided. A heat-release plate for semiconductors and a heat-release component for semiconductors, each utilizing the Cr—Cu alloy, are also provided.

Abstract: High compressibility iron powder that is suitably used for parts with excellent magnetic characteristics or high density sintered parts and that has good productivity is provided from pure iron powder which includes, as impurities in percent by mass, C: 0.005% or less, Si: more than 0.01% and 0.03% or less, Mn: 0.03% or more and 0.07% or less, P: 0.01% or less, S: 0.01% or less, O: 0.10% or less, and N: 0.001% or less, and whose particle includes four or less crystal grains on average and has a micro Vickers hardness (Hv) of 80 or less on average. The circularity of the iron powder is preferably 0.7 or more.

Abstract: In a Cr—Cu alloy that is formed by powder metallurgy and contains a Cu matrix and flattened Cr phases, the Cr content in the Cr—Cu alloy is more than 30% to 80% or less by mass, and the average aspect ratio of the flattened Cr phases is more than 1.0 and less than 100. The Cr—Cu alloy has a small thermal expansion coefficient in in-plane directions, a high thermal conductivity, and excellent processability. A method for producing the Cr—Cu alloy is also provided. A heat-release plate for semiconductors and a heat-release component for semiconductors, each utilizing the Cr—Cu alloy, are also provided.