Abstract: To stabilize a manufacturing yield by suppressing occurrence of scratches and stains on a transparent member provided so as to cover a semiconductor element from a front surface side in a semiconductor device. A semiconductor device includes a substrate, a semiconductor element that is provided on the substrate, a transparent member that is provided on the semiconductor element through a support part, and a sealing resin part that is formed around the semiconductor element and the transparent member on the substrate, and the sealing resin part has a protrusion part having an upper surface thereof perpendicular to the plate thickness direction of the substrate, the upper surface being positioned above a front surface of the transparent member in the plate thickness direction.

Abstract: To provide a solid-state imaging device, by which electrical wiring connection can be made without great difficulty while avoiding problems such as a thermal stress that occurs according to thermal fluctuations resulting from an environmental factor or the like and causes a crack on a cover glass or the like or exfoliation of encapsulating resin.

Abstract: Miniaturization is facilitated in a semiconductor package provided with pixels. A semiconductor package includes a transparent member, a semiconductor chip, a photosensitive rib, and an interposer. In this semiconductor package, pixels are arranged on a part of a chip plane of the semiconductor chip. The photosensitive rib is a photosensitive resin disposed between a region not corresponding to the pixel in the chip plane of the semiconductor chip and the transparent member. Furthermore, the interposer is electrically connected to the semiconductor chip.