Patents by Inventor Ayaka Tsuchiya

Ayaka Tsuchiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLDER MATERIAL
    Publication number: 20210031310
    Abstract: A solder material including 2.5-3.3 wt % Ag, 0.3-0.5 wt % Cu 5.5-6.4 wt % In, and 0.5-1.4 wt % Sb, the remainder being unavoidable impurities and Sn. Specifically, the solder material is a Pb-free solder not including Pb.
    Type: Application
    Filed: March 26, 2018
    Publication date: February 4, 2021
    Inventors: Yukihiko Hirai, Kouki Oomori, Mitsuhiro Isumi, Ayaka Tsuchiya