Patents by Inventor Ayako Furuko

Ayako Furuko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10689552
    Abstract: A main object of the present disclosure is to provide a block copolymer composition that allows an adhesive composition having excellent die-cutting properties, softening agent anti-migration performance, mandrel properties and transparency to be obtained.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: June 23, 2020
    Assignee: ZEON CORPORATION
    Inventors: Ayako Furuko, Sadaharu Hashimoto
  • Publication number: 20200002523
    Abstract: An acrylic rubber includes a (meth)acrylate ester monomeric unit; and a crosslinkable monomeric unit, wherein a complex viscosity at 60° C. denoted as ?*(60° C.) and a complex viscosity at 100° C. denoted as ?*(100° C.) satisfy the following formula (1) and the following formula (2). ?*(100° C.)/?*(60° C.)<0.8??(1) ?*(100° C.
    Type: Application
    Filed: January 26, 2018
    Publication date: January 2, 2020
    Applicant: ZEON CORPORATION
    Inventors: Ayako FURUKO, Kazuhiro EJIRI, Hirofumi MASUDA
  • Patent number: 10174230
    Abstract: The present invention is a block copolymer composition comprising an aromatic vinyl-isoprene-aromatic vinyl triblock copolymer (A) and an aromatic vinyl-isoprene diblock copolymer (B), (i) a ratio (MwDa/MwDb) of a weight average molecular weight MwDa of a polyisoprene block in the triblock copolymer (A) to a weight average molecular weight MwDb of a polyisoprene block in the diblock copolymer (B) being 0.5 or more to less than 1, (ii) a ratio of an aromatic vinyl monomer unit in all polymer components of the block copolymer composition being 10 to 30 mass %, and (iii) the block copolymer composition having a breaking strength of less than 8 MPa and an elongation at break of less than 1,100%; a pressure-sensitive adhesive composition comprising the block copolymer composition and a tackifying resin; and a pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive layer that comprises the pressure-sensitive adhesive composition.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: January 8, 2019
    Assignee: ZEON CORPORATION
    Inventors: Ayako Furuko, Sadaharu Hashimoto
  • Publication number: 20180265755
    Abstract: A main object of the present disclosure is to provide a block copolymer composition that allows an adhesive composition having excellent die-cutting properties, softening agent anti-migration performance, mandrel properties and transparency to be obtained.
    Type: Application
    Filed: September 16, 2016
    Publication date: September 20, 2018
    Applicant: ZEON CORPORATION
    Inventors: Ayako FURUKO, Sadaharu HASHIMOTO
  • Publication number: 20170298258
    Abstract: The present invention is a block copolymer composition comprising an aromatic vinyl-isoprene-aromatic vinyl triblock copolymer (A) and an aromatic vinyl-isoprene diblock copolymer (B), (i) a ratio (MwDa/MwDb) of a weight average molecular weight MwDa of a polyisoprene block in the triblock copolymer (A) to a weight average molecular weight MwDb of a polyisoprene block in the diblock copolymer (B) being 0.5 or more to less than 1, (ii) a ratio of an aromatic vinyl monomer unit in all polymer components of the block copolymer composition being 10 to 30 mass %, and (iii) the block copolymer composition having a breaking strength of less than 8 MPa and an elongation at break of less than 1,100%; a pressure-sensitive adhesive composition comprising the block copolymer composition and a tackifying resin; and a pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive layer that comprises the pressure-sensitive adhesive composition.
    Type: Application
    Filed: September 24, 2015
    Publication date: October 19, 2017
    Applicant: ZEON CORPORATION
    Inventors: Ayako FURUKO, Sadaharu HASHIMOTO
  • Patent number: 9193893
    Abstract: Disclosed is a block copolymer composition for a hot melt adhesive, comprising a block copolymer A and a block copolymer B each having a particular structure, characterized in that the aromatic vinyl monomer unit content of the block copolymer A is 30% to 50% by weight; the aromatic vinyl monomer unit content of the block copolymer B is 15% to 25% by weight; a content of the aromatic vinyl monomer units relative to all polymer components of the block copolymer composition is 18% to 45% by weight; the weight ratio (A/B) of the block copolymer A with respect to the block copolymer B is 20/80 to 80/20; and the ratio (MwA/MwB) of the weight average molecular weight of the block copolymer A (MwA) with respect to the weight average molecular weight of the block copolymer B (MwB) is 0.65 to 1.5.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: November 24, 2015
    Assignee: ZEON CORPORATION
    Inventors: Ryouji Oda, Ayako Furuko
  • Publication number: 20140350164
    Abstract: Provided is a block copolymer composition for a hot melt adhesive, which can provide a hot melt adhesive composition having excellent softening agent retainability, heat resistance and transparency. Disclosed is a block copolymer composition for a hot melt adhesive, comprising a block copolymer A and a block copolymer B each having a particular structure, characterized in that the aromatic vinyl monomer unit content of the block copolymer A is 30% to 50% by weight; the aromatic vinyl monomer unit content of the block copolymer B is 15% to 25% by weight; a content of the aromatic vinyl monomer units relative to all polymer components of the block copolymer composition is 18% to 45% by weight; the weight ratio (A/B) of the block copolymer A with respect to the block copolymer B is 20/80 to 80/20; and the ratio (MwA/MwB) of the weight average molecular weight of the block copolymer A (MwA) with respect to the weight average molecular weight of the block copolymer B (MwB) is 0.65 to 1.5.
    Type: Application
    Filed: December 26, 2012
    Publication date: November 27, 2014
    Inventors: Ryouji Oda, Ayako Furuko
  • Patent number: 8501869
    Abstract: Provided is a hot-melt adhesive composition which can be easily applied at a relatively low temperature, has a long open time, and also has high holding power. A hot-melt adhesive composition comprising a block copolymer composition which includes a block copolymer A and a block copolymer B, and a tackifying resin, wherein a weight ratio (A/B) of the block copolymer A and the block copolymer B is 25/75 to 90/10, and an aromatic vinyl monomer unit content of the block copolymer A is 41% or greater.
    Type: Grant
    Filed: December 25, 2009
    Date of Patent: August 6, 2013
    Assignee: Zeon Corporation
    Inventors: Ryouji Oda, Sadaharu Hashimoto, Ayako Furuko
  • Publication number: 20110257337
    Abstract: Provided is a hot-melt adhesive composition which can be easily applied at a relatively low temperature, has a long open time, and also has high holding power. A hot-melt adhesive composition comprising a block copolymer composition which includes a block copolymer A and a block copolymer B, and a tackifying resin, wherein a weight ratio (A/B) of the block copolymer A and the block copolymer B is 25/75 to 90/10, and an aromatic vinyl monomer unit content of the block copolymer A is 41% or greater.
    Type: Application
    Filed: December 25, 2009
    Publication date: October 20, 2011
    Inventors: Ryouji Oda, Sadaharu Hashimoto, Ayako Furuko