Patents by Inventor Ayako HIMURO

Ayako HIMURO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140138667
    Abstract: An organic semiconductor device includes a laminate and films sealing the laminate in which excellent connection precision is achieved between connection lands and electrodes by suppression of slipping between the laminate and the films upon sealing of the laminate under evacuation, and the laminate is highly sealed. The organic semiconductor device has, between a laminate and a first film substrate, an antislip members that suppress slipping between the laminate and the first film substrate upon sealing of the laminate. An open hole and an electrode contained in the laminate are kept aligned by suppressing of the slipping. The electrode contained in the laminate is connected outside the device through the open hole by a conductive material.
    Type: Application
    Filed: January 27, 2014
    Publication date: May 22, 2014
    Applicant: TOKAI RUBBER INDUSTRIES, LTD.
    Inventors: Shingo HIBINO, Ayako HIMURO, Yuzo TAKAO