Patents by Inventor Ayako Iwai

Ayako Iwai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12149392
    Abstract: In the multiple short sequence based SRS, multiple items of sequence data having a short sequence length corresponding to a partial band are used for transmitting SRS in discontinuous bands. In the multiple short sequence based SRS, a terminal specifies a frequency domain to be used for transmitting a reference signal using predetermined sequence data, applies a phase shift index associated with the specified frequency domain to the reference signal, and transmits the reference signal to which the phase shift index is applied by using the specified frequency domain.
    Type: Grant
    Filed: June 8, 2023
    Date of Patent: November 19, 2024
    Assignee: Panasonic Intellectual Property Corporation of America
    Inventors: Takashi Iwai, Tomohumi Takata, Hidetoshi Suzuki, Ayako Horiuchi
  • Publication number: 20240243856
    Abstract: Provided is a base station that performs feedback with regard to data transmission. The base station includes a downlink feedback information (DFI) generation unit and a transmitter. On the basis of a resource allocation configuration that was configured by a terminal, the DFI generation unit determines a transmission method for feedback information that includes a response signal regarding uplink data. The transmitter transmits the feedback information on the basis of the transmission method.
    Type: Application
    Filed: March 26, 2024
    Publication date: July 18, 2024
    Inventors: Tomoya NUNOME, Takashi IWAI, Hidetoshi SUZUKI, Ayako HORIUCHI, Yoshihiko OGAWA
  • Patent number: 8299664
    Abstract: A special terminal may project from an encapsulation body of a semiconductor module and may be engaged with an engaging portion of a motor case to limit a positional deviation of the semiconductor module relative to the motor case. Additionally or alternatively, a module side engaging portion may be formed in the encapsulation body and may be engaged with a case side engaging portion to position the semiconductor module relative to the motor case.
    Type: Grant
    Filed: June 24, 2010
    Date of Patent: October 30, 2012
    Assignees: Denso Corporation, Asmo Co., Ltd.
    Inventors: Ayako Iwai, Masashi Yamasaki, Hideki Kabune, Atsushi Furumoto, Yoshimasa Kinpara
  • Patent number: 8247937
    Abstract: A V1 semiconductor module has a coil terminal, which is directly connectable to a lead wire of a coil. As a result, the number of parts required to connect electronic parts is reduced. Further, since no printed circuit board is required, the coil terminal can be shaped in any size without being limited in correspondence to the thickness of a copper film of the substrate. The coil terminal and control terminals, which are connected to the printed circuit board having a control circuit for controlling current supply to the coil, are provided on different wall surfaces of a resin part. Thus, the coil and the printed circuit board can be readily connected to the coil terminal and the control terminals, respectively, resulting in simplification of the device.
    Type: Grant
    Filed: June 24, 2010
    Date of Patent: August 21, 2012
    Assignee: Denso Corporation
    Inventors: Hideki Minato, Hideki Kabune, Atsushi Furumoto, Ayako Iwai
  • Publication number: 20100327677
    Abstract: A special terminal may project from an encapsulation body of a semiconductor module and may be engaged with an engaging portion of a motor case to limit a positional deviation of the semiconductor module relative to the motor case. Additionally or alternatively, a module side engaging portion may be formed in the encapsulation body and may be engaged with a case side engaging portion to position the semiconductor module relative to the motor case.
    Type: Application
    Filed: June 24, 2010
    Publication date: December 30, 2010
    Applicants: DENSO CORPORATION, ASMO CO., LTD.
    Inventors: Ayako IWAI, Masashi Yamasaki, Hideki Kabune, Atsushi Furumoto, Yoshimasa Kinpara
  • Publication number: 20100327709
    Abstract: A V1 semiconductor module has a coil terminal, which is directly connectable to a lead wire of a coil. As a result, the number of parts required to connect electronic parts is reduced. Further, since no printed circuit board is required, the coil terminal can be shaped in any size without being limited in correspondence to the thickness of a copper film of the substrate. The coil terminal and control terminals, which are connected to the printed circuit board having a control circuit for controlling current supply to the coil, are provided on different wall surfaces of a resin part. Thus, the coil and the printed circuit board can be readily connected to the coil terminal and the control terminals, respectively, resulting in simplification of the device.
    Type: Application
    Filed: June 24, 2010
    Publication date: December 30, 2010
    Applicant: DENSO CORPORATION
    Inventors: Hideki MINATO, Hideki Kabune, Atsushi Furumoto, Ayako Iwai