Patents by Inventor Ayako Iwamaru

Ayako Iwamaru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7202283
    Abstract: The present invention provides a dissolution method for saturated polyester capable of recycling saturated polyester used in fibers, a film, a bottle and others with ease and a low cost, a solution decomposing saturated polyester and a decomposition method using the solution.
    Type: Grant
    Filed: November 13, 2002
    Date of Patent: April 10, 2007
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Hisayo Masuda, Katsuji Shibata, Hiroyuki Izawa, Ayako Iwamaru
  • Patent number: 6962628
    Abstract: A method of treating a composite material of epoxy resin-cured product and inorganic matter to easily recover the resin components in a recyclable state without causing thermal decomposition. A method of separating the inorganic matter. The epoxy resin-cured product is treated with a treatment liquid which contains a decomposition catalyst for epoxy resin-cured products and an organic solvent to decompose and dissolve the epoxy resin-cured product. A composite material of epoxy resin-cured product and inorganic matter is also treated to decompose and dissolve the epoxy resin-cured product in the above-mentioned manner and the inorganic matter is then separated from the liquid.
    Type: Grant
    Filed: October 5, 2000
    Date of Patent: November 8, 2005
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Katsuji Shibata, Hiroshi Shimizu, Ayako Iwamaru, Takeshi Horiuchi
  • Publication number: 20050027023
    Abstract: The present invention provides a dissolution method for saturated polyester capable of recycling saturated polyester used in fibers, a film, a bottle and others with ease and a low cost, a solution decomposing saturated polyester and a decomposition method using the solution.
    Type: Application
    Filed: November 13, 2002
    Publication date: February 3, 2005
    Inventors: Hisayo Masuda, Katsuji Shibata, Hiroyuki Izawa, Ayako Iwamaru