Patents by Inventor Ayako Maekawa

Ayako Maekawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND CHEMICAL MECHANICAL POLISHING METHOD
    Publication number: 20130331004
    Abstract: According to one embodiment, a semiconductor device manufacturing method comprises forming a film to be polished on a semiconductor substrate, and performing a CMP method on the film to be polished. The CMP method includes polishing the film to be polished by bringing a surface of the film to be polished into contact with a surface of a polishing pad having a negative Rsk value.
    Type: Application
    Filed: June 11, 2013
    Publication date: December 12, 2013
    Inventors: Gaku MINAMIHABA, Akifumi Gawase, Hajime Eda, Yukiteru Matsui, Satoshi Kamo, Naoki Nishiguchi, Ayako Maekawa
  • CHEMICAL MECHANICAL POLISHING PAD AND CHEMICAL MECHANICAL POLISHING METHOD USING SAME
    Publication number: 20130316621
    Abstract: A chemical mechanical polishing pad includes a polishing layer that is formed of a composition that includes a polyurethane, the polishing layer having a specific gravity of 1.1 to 1.3 and a thermal conductivity of 0.2 W/m·K or more.
    Type: Application
    Filed: December 2, 2011
    Publication date: November 28, 2013
    Applicant: JSR CORPORATION
    Inventors: Ayako Maekawa, Satoshi Kamo, Naoki Nishiguchi, Hirotaka Shida, Takahiro Okamoto, Kotaro Kubo
  • PAD FOR CHEMICAL MECHANICAL POLISHING AND METHOD OF CHEMICAL MECHANICAL POLISHING USING SAME
    Publication number: 20120322348
    Abstract: A chemical mechanical polishing pad includes a polishing layer formed using a composition that includes a thermoplastic polyurethane, the polishing layer having a specific gravity of 1.15 to 1.30, and a durometer D hardness of 50 to 80.
    Type: Application
    Filed: December 14, 2010
    Publication date: December 20, 2012
    Applicant: JSR Corporation
    Inventors: Katsutaka Yokoi, Ayako Maekawa, Hirotaka Shida, Satoshi Kamo, Shinji Tonsho, Keiichi Satou, Naoki Nishiguchi, Hiroyuki Tano