Abstract: This optical cell for sedimentation analysis has a pair of opposing surfaces through which light is transmitted, and two polarizing plates, in which each of the two polarizing plates is disposed in a crossed Nicols state on each of the inner surfaces of the pair of opposing surfaces.

Abstract: The power transmission sheet (22) includes a base portion (225) adhered to the surface of a wall portion (50), transfers power by wireless power supply to a plug, and has a deformable shape. This power transmission sheet (22) is provided with: an electrode layer (222c) including electrodes (222a) and electrodes (222b) arranged in an array; a wiring portion (221) for transferring power to the electrodes (222a, 222b); a covering layer (223) formed on a surface opposite to the base portion (225) adhered on the wall portion (50) as viewed from the electrode layer (222c); and an attachable structure in which a plug can be attached such that the electrode surface provided on the plug confronts the electrodes (222a, 222b) with the covering layer (223) interposed therebetween.

Abstract: The power transmitter used for wireless power supply, includes a structure in which a sheet of a conductive body forming plural layers stacked in a thickness direction in a dielectric body. The dielectric body is also located between the plural layers, and different layers of the sheet of the conductive body are electrically connected. The power transmitter easily ensures the insulation properties at a position where the electrode is disposed while improving the power transmission efficiency in the case of the wireless power supply with the electric field coupling system.

Abstract: A wireless power transfer system includes a power transmitter configured to wirelessly transfer alternating-current power components of different frequencies simultaneously, the different frequencies including at least a first frequency and a second frequency, and a power receiver having a rectifier circuit configured to convert the alternating-current power components to a direct-current power component, wherein the first frequency is 0.5 MHz to 10 GHz, and the second frequency is 10 Hz to 300 kHz lower than the first frequency.

Abstract: Provided is a composite material which is obtained by dispersing conductive filler in a polymer material, wherein an amount of the conductive filler added is 1 part by mass to 25 parts by mass with respect to 100 parts by mass of the polymer material, and wherein a relative dielectric constant of the composite material is 30 or higher and a dielectric loss tangent of the composite material is 3 or lower at an AC voltage with a frequency of 100 Hz.

Abstract: An antistatic agent, a water-soluble electroconductive polymer, a solvent and a water-soluble polymer. In preferred embodiments, the water-soluble polymer has a polypeptide bond or a specific polyvinyl structure. Also disclosed is an antistatic film incorporating the antistatic agent, an article coated with an antistatic film and a pattern-forming method using the antistatic film.

Abstract: Provided is a transmission sheet constituting a transmission unit used for a non-contact power transmission system, wherein the transmission sheet comprises a functional composite material layer wherein the functional composite material layer is obtained by dispersing conductive filler in a polymer material, wherein an amount of the conductive filler added in the functional composite material layer is 90 parts by mass or less with respect to 100 parts by mass of the polymer material, and wherein a conductivity of the functional composite material layer is 10 S/m or higher.

Abstract: The present invention aims to provide a polishing composition which allows high-speed polishing of a barrier film and an inter-layer dielectric film along with a wiring metal at the same time, while preventing dishing and erosion, and particularly maintaining the flatness of metal film. The chemical-mechanical polishing composition of the present invention comprises a dicarboxylic acid having 7 to 13 carbon atoms, an oxidizing agent, an abrasive and water.

Abstract: It is an object of the present invention to improve sensitivity of a resist made from hydrosilsesquioxane when a pattern is formed in the resist by irradiation with a charged particle beam. The method for improving sensitivity of a resist of the present invention is a method to improve sensitivity of a resist formed from hydrosilsesquioxane to a charged particle beam when a pattern is formed in the resist by irradiation with a charged particle beam, and is characterized by including prebaking a resist formed from hydrosilsesquioxane and applied onto a substrate at t° C. (20?t?300), applying a composition containing a water-soluble conductive polymer compound to a charged particle beam irradiation surface of the prebaked resist, baking the thus applied composition at T° C. (0?T<t+40) and then irradiating the resist with a charged particle beam.

Abstract: It is an object of the present invention to improve sensitivity of a resist made from hydrosilsesquioxane when a pattern is formed in the resist by irradiation with a charged particle beam. The method for improving sensitivity of a resist of the present invention is a method to improve sensitivity of a resist formed from hydrosilsesquioxane to a charged particle beam when a pattern is formed in the resist by irradiation with a charged particle beam, and is characterized by including prebaking a resist formed from hydrosilsesquioxane and applied onto a substrate at t° C. (20?t?300), applying a composition containing a water-soluble conductive polymer compound to a charged particle beam irradiation surface of the prebaked resist, baking the thus applied composition at T° C. (0?T<t+40) and then irradiating the resist with a charged particle beam.

Abstract: The present invention provide a chemical-mechanical polishing composition for inhibiting dishing and erosion as well as rapidly polishing an insulating film and barrier film at the same time while maintaining the flatness of the substrate surface polished. The present chemical-mechanical polishing composition comprises methanesulfonic acid, an alkali metal ion, an oxidizing agent, a silica abrasive and water, and has a pH of 8 to 12.

Abstract: The present invention provide a chemical-mechanical polishing composition for inhibiting dishing and erosion as well as rapidly polishing an insulating film and barrier film at the same time while maintaining the flatness of the substrate surface polished. The present chemical-mechanical polishing composition comprises methanesulfonic acid, an alkali metal ion, an oxidizing agent, a silica abrasive and water, and has a pH of 8 to 12.

Abstract: The present invention aims to provide a polishing composition which allows high-speed polishing of a barrier film and an inter-layer dielectric film along with a wiring metal at the same time, while preventing dishing and erosion, and particularly maintaining the flatness of metal film. The chemical-mechanical polishing composition of the present invention comprises a dicarboxylic acid having 7 to 13 carbon atoms, an oxidizing agent, an abrasive and water.

Abstract: Solder metal consists essentially of 8.8 to 5.0 mass % of Zn, 0.05 to 0 mass % of Bi and the balance of Sn and unavoidable impurities.

Abstract: The object of the invention is to provide an antistatic agent exhibiting an excellent property of preventing film-thinning phenomenon and fogging in chemically amplified resists, an antistatic film using the antistatic agent and a product coated therewith. The antistatic agent comprising the water-soluble electroconductive polymer, the solvent and the water-soluble polymer. By using a water-soluble polymer, especially a water-soluble polymer compound having a polypeptide bond or a specific water-soluble polymer compound having a polyvinyl structure in combination with a water-soluble electroconductive polymer in an antistatic agent, influences on resist (such as fogging, film-thinning phenomenons and dissolution of resist after developing of resist) can be suppressed even when surfactant is added into the antistatic agent for the purpose of imparting coatability inexpensively and easily, while maintaining coatability of the agent.

Abstract: As a polishing composition which allows high-speed polishing while dishing and erosion are prevented and the flatness of metal film is maintained, there is provided a polishing composition for polishing a metal film provided on a substrate having trenches such that the metal film fills the trenches, so as to provide a planarized surface, wherein the composition comprises water, a phosphate ester having a C?6 carbon atom alkyl group in its molecule, and an etchant for the metal, and has a pH of 5 to 11.

Abstract: Solder metal consists essentially of 8.8 to 5.0 mass % of Zn, 0.05 to 0 mass % of Bi and the balance of Sn and unavoidable impurities.

Abstract: The present invention provides a solid polymer electrolyte; a polymerizable composition having low viscosity and excellent processability for obtaining the solid polymer electrolyte; and a polymerizable compound having low viscosity, and good polymerizability and stability for use in the polymerizable composition. The present invention also provides primary and secondary batteries capable of working with high capacity and current; an electric double-layer capacitor ensuring high output voltage, large takeout current, and good processability; and an electrochromic device favored with high response speed. Each thereof use the solid polymer electrolyte of the present invention and are ensured with long life, excellent safety free of liquid leakage, high reliability and production at a low cost.

Abstract: A metal polishing composition is used for polishing a metal layer and comprises a film forming compound which polymerizes on a surface of the metal layer, forming a polymer film on the surface of the metal layer. A polishing method for the metal layer comprises a step of polishing and planarizing the metal layer using the metal polishing composition. A production method for a wafer comprises a step of polishing and planarizing a metal layer which is formed on top of a wafer that contains recesses so as to fill and cover the recesses, by the polishing method for a metal layer. According to the composition and polishing method, dishing is prevented to improve the planarity, and the polishing rate for polishing metal layers, and particularly copper layers, is improved, enabling high speed polishing at low pressure. Furthermore, because scratching of the metal layer is also prevented, the yield improves.

Abstract: A metal polish composition contains an amine represented by general formula (1): wherein m represents an integer of from 1 to 3 and n represents an integer of from 0 to 2, with m and n being such that (3-n-m) is an integer of from 0 to 2; A represents a straight-chained or branched alkylene, phenylene or substituted phenylene group having 1 to 5 carbon atoms; R1 and R3 each independently represent hydrogen or a substituted or non-substituted hydrocarbon group having 1 to 5 carbon atoms; R3 represents a substituted or non-substituted hydrocarbon group having 1 to 20 carbon atoms; a combination of R1 and R2, a combination of R2 and R3 and a combination of A and R3 can form a ring structure; and R1, R2, R3 and A can individually form a ring structure.