Patents by Inventor Ayako Tohdake

Ayako Tohdake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring substrate
    Patent number: 5532906
    Abstract: A wiring substrate includes a ceramic substrate having a first conductive connection pattern on an lower surface of the ceramic substrate and a second conductive connection pattern on an upper surface or the lower surface of the ceramic substrate, a multilayered wiring portion arranged on the lower surface of the ceramic substrate through the first conductive connection pattern and including an insulating layer made of an organic polymer, on which an integrated circuit and/or a circuit part are/is mounted, and a flexible wiring substrate, connected to the second conductive connection pattern, for connecting the integrated circuit and/or the circuit part to an external circuit.
    Type: Grant
    Filed: July 21, 1995
    Date of Patent: July 2, 1996
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Jun Hanari, Takeshi Miyagi, Kazuhiro Matsumoto, Ayako Tohdake, Yoshitaka Fukuoka