Abstract: A thermal-conductive silicone composition containing (A) 0.5 to 2.5 mass % of a crosslinked silicone gel containing (a) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, and having a kinematic viscosity at 25° C. of 10,000,000 mm2/s or more, and (b) an organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms per molecule; (B) 12.5 to 19.5 mass % of a hydrolysable organopolysiloxane compound; and (C) 80 to 85 mass % of aluminum nitride particles having an average particle size of 0.5 pm or more and 1.5 pm or less. A content of coarse particles in the aluminum nitride particles is 1.0 volume % or less relative to the whole. The coarse particles are 10 pm or more in a particle size distribution by laser diffraction. A thermal-conductive silicone composition has excellent coating workability and favorable pumping-out resistance, and is capable of attaining low thermal resistance by being thinly compressed.

Abstract: A thermally conductive composition 26 contains a base polymer, an adhesive polymer, and thermally conductive particles. A thermal conductivity of the thermally conductive composition 26 is 0.3 W/mK or more. The base polymer is a silicone polymer. The adhesive polymer contains a methyl hydrogen polysiloxane, an epoxy group-containing alkyltrialkoxysilane, and a cyclic polysiloxane oligomer. The amount of the adhesive polymer is 5 to 35 parts by weight with respect to 100 parts by weight of the base polymer. A thermally conductive sheet of the present invention includes the thermally conductive composition in the form of a sheet. Thus, the present invention provides a thermally conductive composition that has high thermal conductive properties and excellent resilience and that can prevent interfacial peeling due to stress, a thermally conductive sheet including the thermally conductive composition, and a method for producing the thermally conductive sheet.

Abstract: A negative thermal expansion glass ceramic having a negative coefficient of thermal expansion, which is a sufficiently large absolute value in a temperature range of ?40° C. to +160° C. and a method for producing the same are provided. The negative thermal expansion glass ceramic has a coefficient of thermal expansion of ?25 to ?100×10?7/° C. in the temperature range of ?40° C. to +160° C., and comprises main crystalline phases which are one or more types selected from a group consisting of ?-eucryptite solid solution (?-Li2O•Al2O3•2SiO2 solid solution), ?-eucryptite (?-Li2O•Al2O3•2SiO2), ?-quartz solid solution (?-SiO2) solid solution), and ?-quartz (?-SiO2), wherein a total amount of crystals of the main crystalline phases can be 70 to 100% in mass percent.