Abstract: A method for manufacturing a wiring substrate includes preparing a substrate including an insulating layer and metal foils, forming a through hole in the substrate to penetrate through the insulating layer and foils, forming a first plating film on the substrate such that the first film is formed on the entire surface of each metal foil and the inner wall of the hole, laminating one or more resin sheets on the first film such that the resin sheet or sheets cover the first film on the entire surface of a respective one of the foils, pressing the resin sheet or sheets such that resin is extruded from the resin sheet or sheets into the hole and fills space surrounded by the first film inside the hole, removing the resin sheet or sheets, and forming a second plating film on the substrate to cover surface of the resin in the hole.

Abstract: A method for manufacturing a wiring substrate includes preparing a support substrate having a metal film layer, forming a plating film layer including an alignment pattern on the metal film layer, forming an insulating layer such that the insulating layer covers the plating film layer, irradiating the insulating layer with laser based on position information obtained from the alignment pattern in the plating film such that a through hole penetrating through the insulating layer is formed, and filling the through hole formed in the insulating layer with conductor such that a via conductor is formed in the insulating layer. The forming of the plating film layer includes causing specular reflectance of light of a predetermined wavelength at an upper surface of the metal film layer formed on the support substrate to differ from specular reflectance of light of the predetermined wavelength at an upper surface of the plating film layer.

Abstract: A method for manufacturing a wiring substrate includes preparing a substrate including an insulating layer and metal foils, forming a through hole in the substrate to penetrate through the insulating layer and foils, forming a first plating film on the substrate such that the first film is formed on the entire surface of each metal foil and the inner wall of the hole, laminating one or more resin sheets on the first film such that the resin sheet or sheets cover the first film on the entire surface of a respective one of the foils, pressing the resin sheet or sheets such that resin is extruded from the resin sheet or sheets into the hole and fills space surrounded by the first film inside the hole, removing the resin sheet or sheets, and forming a second plating film on the substrate to cover surface of the resin in the hole.