Abstract: Gate-all-around structures having devices with source/drain-to-substrate electrical contact are described. An integrated circuit structure includes a first vertical arrangement of horizontal nanowires above a first fin. A first gate stack is over the first vertical arrangement of horizontal nanowires. A first pair of epitaxial source or drain structures is at first and second ends of the first vertical arrangement of horizontal nanowires. One or both of the first pair of epitaxial source or drain structures is directly electrically coupled to the first fin. A second vertical arrangement of horizontal nanowires is above a second fin. A second gate stack is over the second vertical arrangement of horizontal nanowires. A second pair of epitaxial source or drain structures is at first and second ends of the second vertical arrangement of horizontal nanowires. Both of the second pair of epitaxial source or drain structures is electrically isolated from the second fin.

Abstract: An integrated circuit structure includes a sub-fin having (i) a first portion including a p-type dopant and (ii) a second portion including an n-type dopant. A first body of semiconductor material is above the first portion of the sub-fin, and a second body of semiconductor material is above the second portion of the sub-fin. In an example, the first portion of the sub-fin and the second portion of the sub-fin are in contact with each other, to form a PN junction of a diode. For example, the first portion of the sub-fin is part of an anode of the diode, and wherein the second portion of the sub-fin is part of a cathode of the diode.

Abstract: A thermoelectric device may include a first substrate, a second substrate, and a plurality of thermoelectric elements positioned between the first and second substrates. The thermoelectric device may also include a first attachment material connecting each thermoelectric element of the plurality of thermoelectric elements to the first substrate, and a second attachment material connecting each thermoelectric element of the plurality of thermoelectric elements to the second substrate. The first attachment material may have a higher liquidus temperature than a liquidus temperature of the second attachment material.

Abstract: A thermoelectric device may include a first substrate, a second substrate, and a plurality of thermoelectric elements positioned between the first and second substrates. The thermoelectric device may also include a first attachment material connecting each thermoelectric element of the plurality of thermoelectric elements to the first substrate, and a second attachment material connecting each thermoelectric element of the plurality of thermoelectric elements to the second substrate. The first attachment material may have a higher liquidus temperature than a liquidus temperature of the second attachment material.

Abstract: A method and system for efficiently cooling a fluid is provided. A cooling system includes a first chamber containing a first fluid, and a second chamber connected to the first chamber and containing a second fluid. The cooling system further includes one or more thermoelectric devices for cooling the second fluid in the second chamber, and a first body that acts as a thermal diode. The first body enables unidirectional transfer of heat from the thermoelectric devices to the first fluid. Further, the cooling system can be installed with one or more phase change materials or heat pipes that enhance the cooling efficiency of the cooling system. The thermoelectric devices are switched on for a certain time period, after which they are switched off and on repeatedly in cycles, depending on the temperature of the second fluid.

Abstract: In various embodiments of the present invention, a thermoelectric device is provided. The thermoelectric device includes one or more thermoelements that transfer heat across the ends of the thermoelectric device. A method for creating the thermoelectric device includes forming a metal substrate, and etching one or more surfaces of the metal substrate to form etched portions. The unetched flat portions on the metal substrate are referred to as mesa cores. Thereafter, thermoelectric films are deposited on the one or more surfaces of the metal substrate. The deposition of the thermoelectric films on the mesa cores results in the formation of a thermoelement.

Abstract: An apparatus and method configured to provide electric power from a thermal source. The apparatus may include a thermoelectric generator and a heat source. The apparatus may include a fuel source. The heat source may be combustive or non-combustive. The apparatus may also include a thermal battery. The heat source may be configured to combust a hydrocarbon fuel to generated heat. The apparatus may include one or more thermal diodes and/or a heat sink to remove waste heat. The method may include converting thermal energy into electrical energy using the apparatus. The method may also include powering a light or other electrical load using the apparatus. The present disclosure includes a method for manufacturing the apparatus.

Abstract: The present disclosure is related to an apparatus for generating electric power from selected wavelengths of electromagnetic radiation and a method of manufacture of said apparatus. The apparatus may include a selective wavelength absorber that is thermally coupled to a thermoelectric generator. The selective wavelength absorber may include alternating absorber and dielectric layers configured to absorb and reflect selected wavelengths of electromagnetic radiation. Absorbed electromagnetic radiation may be converted to heat energy for driving the thermoelectric generator. The method may include manufacturing the selective wavelength absorber, including depositing the alternating layers on a substrate that has been formed to receive the electromagnetic radiation at a selected angle or range of angles.

Abstract: The present disclosure is related to an apparatus for transporting heat using a thermoelectric converter. The apparatus may include a thermoelectric converter, such as a thin-film. The apparatus may include a heating loop in thermal communication with a hot side of the thermoelectric converter and a cooling loop in thermal communication with a cold side of the thermoelectric converter. The thermoelectric converter may include a stack of alternating thermoelement and constricted contact layers. The thermoelectric converter may have a counter-flow fluid loop that moves a fluid against the temperature gradient of the thermoelectric converter. The apparatus may be configured to provide heating or cooling of a fluid, such as air or water. The apparatus may include a thermal storage medium configured as a thermal battery.

Abstract: In various embodiments of the present invention, a thermoelectric cooling device with a thermoelectric device, heat pipe and a heat sink is provided. The thermoelectric device is connected to a chamber through a metal standoff. The chamber contains a fluid that needs to be cooled. The metal standoff has a shape, e.g. a bevel shape, to minimize heat leakage into the fluid. The heat pipes are preferably connected to the thermoelectric device with a Thermal Interface Material (TIM). In one embodiment, the heat pipes are attached to the thermoelectric device through screws which have an insulating standoff so as to minimize heat leakage into the fluid. In another embodiment of the present invention, two stage thermoelectric cooling devices with multiple heat pipes and common heat sink are provided to cool the fluid.

Abstract: The present disclosure provides a method and a thermoelectric cooling apparatus for cooling a fluid. The thermoelectric cooling apparatus comprises one or more of thermoelectric devices, a hot sink, a cold sink, and a heat rejection apparatus which comprises condenser fins and a fan to attain a high figure of merit. The heat from the fluid is transferred to the hot sink and/or one or more heat pipes by the one or more thermoelectric devices. The heat from the one or more heat pipes is dissipated to the ambient through condenser fins and the fan.

Abstract: The present disclosure provides a thermoelectric cooling system with improved performance. The thermoelectric cooling system comprises a thermoelectric cooling unit. The thermoelectric cooling unit comprises a thermoelectric device, heat pipes, condenser fins, a cold sink and a cold fan. The thermoelectric cooling unit can be easily assembled with a chamber which contains a fluid to be cooled. The thermoelectric cooling system comprises screws to attach the thermoelectric cooling unit to the chamber, and sealant rings to prevent heat leakage in the thermoelectric cooling system. Further, the present disclosure provides a thermoelectric cooling system with a freezer part and a refrigerator part. The freezer part encloses the cold sink and the cold fan. The freezer part is cooled by the thermoelectric device, and the refrigerator part is cooled by walls of the freezer part. Further, the present disclosure provides a thermoelectric cooling system for use as a wine cooler.

Abstract: In various embodiments of the present invention, a thermoelectric cooling device with a thermoelectric device, heat pipe and a heat sink is provided. The thermoelectric device is connected to a chamber through a metal standoff. The chamber contains a fluid that needs to be cooled. The metal standoff has a shape, e.g. a bevel shape, to minimize heat leakage into the fluid. The heat pipes are preferably connected to the thermoelectric device with a Thermal Interface Material (TIM). In one embodiment, the heat pipes are attached to the thermoelectric device through screws which have an insulating standoff so as to minimize heat leakage into the fluid. In another embodiment of the present invention, two stage thermoelectric cooling devices with multiple heat pipes and common heat sink are provided to cool the fluid.

Abstract: In various embodiments of the present invention, a device for converting incident radiation to electrical energy is provided. The device includes a Thermoelectric Generator (TEG) and a Photovoltaic Cell (PV) to convert the incident radiation to electrical energy. The device further includes a first component for focusing the incident radiation to the TEG and the PV. The incident radiation includes light waves of infrared wavelengths, and light waves of the visible light spectrum and Ultraviolet (UV) waves. The TEG converts the heat generated due to the light waves of infrared wavelength into electricity, and the PV converts energy of the light waves of the visible light spectrum and UV waves into electricity.

Abstract: In various embodiments of the present invention, a thermoelectric device is provided. The thermoelectric device includes one or more thermoelements that transfer heat across the ends of the thermoelectric device. A method for creating the thermoelectric device includes forming a metal substrate, and etching one or more surfaces of the metal substrate to form etched portions. The unetched flat portions on the metal substrate are referred to as mesa cores. Thereafter, thermoelectric films are deposited on the one or more surfaces of the metal substrate. The deposition of the thermoelectric films on the mesa cores results in the formation of a thermoelement.

Abstract: A method and system for efficiently cooling a fluid is provided. A cooling system includes a first chamber containing a first fluid, and a second chamber connected to the first chamber and containing a second fluid. The cooling system further includes one or more thermoelectric devices for cooling the second fluid in the second chamber, and a first body that acts as a thermal diode. The first body enables unidirectional transfer of heat from the thermoelectric devices to the first fluid. Further, the cooling system can be installed with one or more phase change materials or heat pipes that enhance the cooling efficiency of the cooling system. The thermoelectric devices are switched on for a certain time period, after which they are switched off and on repeatedly in cycles, depending on the temperature of the second fluid.

Abstract: In various embodiments of the present invention, a thermoelectric device is provided. The thermoelectric device includes one or more thermoelements provided for transferring heat across the ends of the thermoelectric device. A method for making the thermoelectric device includes forming a metal substrate, and depositing one or more thermoelectric films on the metal substrate. Thereafter, one or more bumps are provided on one of the one or more thermoelectric films. Deposition of the one or more thermoelectric films on the metal substrate and the provision of the one or more bumps on the thermoelectric film result in the formation of a thermoelement.