Abstract: The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to each other on a first board 11 with a plurality of second electrodes 22 and 23 provided to be adjacent to each other on a second board 21 through an adhesive 30 that contains conductive particles 31 and that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrode 12 and second electrode 22 and between the mutually facing first electrode 13 and second electrode 23, an adhesive layer 30a is formed between the first board 11 and the second board 21 and in the adhesive layer 30a, a cavity portion 33 is formed between the first electrodes 12 and 13 and between the second electrodes 22 and 23.

Abstract: The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to each other on a first board 11 with a plurality of second electrodes 22 and 23 provided to be adjacent to each other on a second board 21 through an adhesive 30 that contains conductive particles 31 and that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrode 12 and second electrode 22 and between the mutually facing first electrode 13 and second electrode 23, an adhesive layer 30a is formed between the first board 11 and the second board 21 and in the adhesive layer 30a, a cavity portion 33 is formed between the first electrodes 12 and 13 and between the second electrodes 22 and 23.

Abstract: To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.

Abstract: A metallic porous body comprises a metallic framework having a three-dimensional network with a continuous-pore structure formed by linking sub-stantially polyhedral cells. The substantially polyhedral cells have an average cell diameter of about 200 to about 300 &mgr;m and an average window diameter of about 100 to about 200 &mgr;m. The metallic porous body can be obtained by the following method, for instance: First, a plastic porous body is provided that has an average cell diameter of about 200 to about 300 &mgr;m and an average window diameter of about 100 to about 200 &mgr;m. Second, a conductive layer is formed on a surface of the framework of the plastic porous body to produce a conductive porous body having a resistivity of about 1 k&OHgr;·cm or less. Finally, a continuous metal-plated layer is formed on a surface of the conductive layer by electroplating, with the conductive porous body serving as the cathode.

Abstract: To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.

Abstract: A conductive porous body that has a conductive layer almost free from impurities and that enables a metallic porous body having extremely low resistance to be produced with high productivity and production efficiency, and a metallic porous body and a battery plate both produced by using the conductive porous body. The conductive porous body has a nickel conductive layer formed on the surface of the framework of a plastic porous body having a continuous-pore structure. The conductive layer is formed by the deposition of nickel from an aqueous solution containing nickel compounds with the use of a reducing agent containing titanium compounds. The metallic porous body can be obtained by forming a continuous metal-plated layer on the surface of the framework of the conductive porous body. The metal-plated layer is formed by electroplating with the conductive porous body serving as the cathode. The battery plate consists mainly of the metallic porous body.

Abstract: To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.

Abstract: An improved electrode for an alkaline storage battery can suppress the reduction of the battery capacity when the battery is used in a high-temperature environment. The electrode is formed by charging or filling a collector, which consists of a porous body of a nickel-boron alloy containing 0.001 to 3 percent by weight of boron, with an active material. The porous body of the nickel-boron alloy can be formed by depositing nickel on a surface of a substrate consisting of a porous polymer by electroless plating with a boron compound serving as a reductant.