Patents by Inventor Ayao Niki

Ayao Niki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Roll coater for coating and method of manufacturing printed wiring board employing the roll coater
    Patent number: 6645297
    Abstract: A roll coater with which an interlaminar resin insulating layer and/or a solder resist layer can be formed with good thickness uniformity to enable the manufacture of a printed circuit board free from the no-hole defect and anomalies in the diameter and geometry of the holes for via-hole and/or solder bump which is due to uneven layer thickness, thus having high electrical integrity and reliability.
    Type: Grant
    Filed: August 21, 2001
    Date of Patent: November 11, 2003
    Assignees: Ibiden Co., Ltd., Kabushiki Kaisha Toyoda Jidoshokki Seisakusho
    Inventors: Ayumi Suzuki, Ayao Niki, Ryo Aoki, Kazuhisa Kitajima, Susumu Kagohashi, Yukari Kajiyama, Hiroshi Tanaka
  • Solder resist composition and printed circuit boards
    Patent number: 6217987
    Abstract: A solder resist composition comprises an acrylate of novolac type epoxy resin and an imidazole curing agent and has a viscosity of 0.5-10 Pa·s adjusted with glycol ether type solvent. A printed circuit board is formed by using such a solder resist composition.
    Type: Grant
    Filed: September 16, 1997
    Date of Patent: April 17, 2001
    Assignee: Ibiden Co. Ltd.
    Inventors: Yoshitaka Ono, Akihiko Goto, Ayao Niki, Motoo Asai