Patents by Inventor Ayoung BAK

Ayoung BAK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11417787
    Abstract: A solar cell module and a method for manufacturing the same are discussed. The solar cell module includes a plurality of solar cells each including a semiconductor substrate and first and second electrodes, each of which has a different polarity and is extended in a first direction on a back surface of the semiconductor substrate, and a plurality of conductive lines extended in a second direction crossing the first direction on the back surface of the semiconductor substrate, connected to one of the first and second electrodes through a conductive adhesive, and insulated from the other electrode by an insulating layer. The conductive adhesive includes a first adhesive layer connected to the one electrode and a second adhesive layer positioned on the first adhesive layer and connected to the plurality of conductive lines.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: August 16, 2022
    Assignee: LG ELECTRONICS INC.
    Inventors: Hyeyoung Yang, Chunghyun Lim, Taehee Shin, Bojoong Kim, Taeki Woo, Ayoung Bak, Daesung Son, Junhan Kwon
  • Patent number: 10608131
    Abstract: Disclosed is a solar cell including: a solar cell including an electrode; a wiring portion electrically connected to the electrode of the solar cell; a connection member positioned between the electrode and the wiring portion at a connection portion of the electrode and the wiring portion to electrically connect the electrode and the wiring portion; and an insulating layer covering the electrode entirely where the connection member is not positioned to insulate the electrode and the wiring portion at a portion other than the connection portion. The insulating layer includes an organic solderability preservative (OSP).
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: March 31, 2020
    Assignee: LG ELECTRONICS INC.
    Inventors: Daeseon Hyun, Ayoung Bak
  • Publication number: 20190103500
    Abstract: Disclosed is a solar cell panel including a solar cell; a sealing member surrounding and sealing the solar cell; a moisture barrier layer positioned between the solar cell and the sealing member and including silicon, a first cover member positioned at a surface of the solar cell on the sealing member; and a second cover member positioned at another surface of the solar cell on the sealing member.
    Type: Application
    Filed: September 19, 2018
    Publication date: April 4, 2019
    Applicant: LG ELECTRONICS INC.
    Inventors: Jinhyung LEE, Sangwook PARK, Ayoung BAK, Jemin YU
  • Publication number: 20190044013
    Abstract: Disclosed is a solar cell including: a solar cell including an electrode; a wiring portion electrically connected to the electrode of the solar cell; a connection member positioned between the electrode and the wiring portion at a connection portion of the electrode and the wiring portion to electrically connect the electrode and the wiring portion; and an insulating layer covering the electrode entirely where the connection member is not positioned to insulate the electrode and the wiring portion at a portion other than the connection portion. The insulating layer includes an organic solderability preservative (OSP).
    Type: Application
    Filed: August 6, 2018
    Publication date: February 7, 2019
    Applicant: LG ELECTRONICS INC.
    Inventors: Daeseon HYUN, Ayoung BAK
  • Publication number: 20170069776
    Abstract: A solar cell module and a method for manufacturing the same are discussed. The solar cell module includes a plurality of solar cells each including a semiconductor substrate and first and second electrodes, each of which has a different polarity and is extended in a first direction on a back surface of the semiconductor substrate, and a plurality of conductive lines extended in a second direction crossing the first direction on the back surface of the semiconductor substrate, connected to one of the first and second electrodes through a conductive adhesive, and insulated from the other electrode by an insulating layer. The conductive adhesive includes a first adhesive layer connected to the one electrode and a second adhesive layer positioned on the first adhesive layer and connected to the plurality of conductive lines.
    Type: Application
    Filed: September 8, 2016
    Publication date: March 9, 2017
    Applicant: LG ELECTRONICS INC.
    Inventors: Hyeyoung YANG, Chunghyun LIM, Taehee SHIN, Bojoong KIM, Taeki WOO, Ayoung BAK, Daesung SON, Junhan KWON