Patents by Inventor Ayse Durmus

Ayse Durmus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND APPARATUS FOR COPPER ELECTROPLATING
    Publication number: 20090065365
    Abstract: A method and apparatus for a copper electroplating procedure, wherein a first additive is preferentially adsorbed onto the field region of a substrate and a second additive is preferentially adsorbed onto the surfaces of at least one recessed region of the substrate, is provided. The first additive is more resistive to the electrodeposition relative to the second additive such that the recessed regions are filled at a faster rate than a layer is deposited on the field region.
    Type: Application
    Filed: September 11, 2007
    Publication date: March 12, 2009
    Applicant: ASM NUTOOL, INC.
    Inventors: Ayse Durmus, Ismail Emesh