Abstract: According to one embodiment, a pattern formation method includes grouping an unevenness pattern of a template into a plurality of groups having different pattern sizes. The method includes using a nozzle having a relatively small nozzle diameter to dispense an imprint resist in liquid form into a region on a substrate where the unevenness pattern of a group of the plurality of groups having a relatively small pattern size is to be aligned, and using a nozzle having a relatively large nozzle diameter to dispense the liquid imprint resist into one other region on the substrate where the unevenness pattern of a group of the plurality of groups having a relatively large pattern size is to be aligned. The method includes curing the imprint resist. The method includes releasing the template from the cured imprint resist.

Abstract: A pattern transfer method for transferring an uneven pattern onto a resist material is disclosed. The uneven pattern is formed in a template having a through-groove in a predetermined region. The resist material is applied to a substrate. The template is made to come into contact with the resist material. The resist material is filled to concave portion in the uneven pattern. The residual resist material leaked from a gap between the substrate and the template to the outside is sucked through the through-groove in a state where the template is in contact with the resist material. The resist material is made to cure in a state where the template is in contact with the resist material after the suction of the residual resist material. The template is separated from the cured resist material.

Abstract: A pattern generation method of generating a three-dimensional pattern to be formed at a template for use in a method of forming a pattern by filling a resist material in the three-dimensional pattern of the template includes performing at least one of adjustment of a depth of the three-dimensional pattern and division of the three-dimensional pattern, based on a relationship between a filling time of the resist material and a dimension or shape of the three-dimensional pattern.