Patents by Inventor Ayumi Senda

Ayumi Senda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8531552
    Abstract: Charging of a camera and backup of data are concurrently executed to enable picking up an image regardless of a remaining available memory. As the camera is attached to a cradle, image data for the image picked up by a camera module of the camera is directly transferred to and recorded in a HDD of the cradle. Image data, already recorded in the flash memory of the camera, is backed up by the HDD of the cradle. Further, the cradle allows a charging circuit to charge a rechargeable battery of the camera using electric power supplied via an AC cord. Also, the cradle has a tripod bore through which the camera is fixed to a tripod for picking up the image.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: September 10, 2013
    Assignee: Sony Corporation
    Inventor: Ayumi Senda
  • Publication number: 20110169967
    Abstract: Charging of a camera and backup of data are concurrently executed to enable picking up an image regardless of a remaining available memory. As the camera is attached to a cradle, image data for the image picked up by a camera module of the camera is directly transferred to and recorded in a HDD of the cradle. Image data, already recorded in the flash memory of the camera, is backed up by the HDD of the cradle. Further, the cradle allows a charging circuit to charge a rechargeable battery of the camera using electric power supplied via an AC cord. Also, the cradle has a tripod bore through which the camera is fixed to a tripod for picking up the image.
    Type: Application
    Filed: January 14, 2011
    Publication date: July 14, 2011
    Applicant: SONY CORPORATION
    Inventor: Ayumi Senda
  • Patent number: 7940312
    Abstract: Charging of a camera 100 and backup of data are concurrently executed to enable picking up an image regardless of a remaining available memory. As the camera 100 is attached to a cradle 200, image data for the image picked up by a camera module 110 of the camera 100 is directly transferred to and recorded in a HDD 220 of the cradle 200. Image data, already recorded in the flash memory 133 of the camera 100, is backed up by the HDD 220 of the cradle 200. Further, the cradle 200 allows a charging circuit 204 to charge a rechargeable battery of the camera 100 using electric power supplied via an AC cord 280. Also, the cradle 200 has a tripod bore 270 through which the camera is fixed to a tripod for picking up the image.
    Type: Grant
    Filed: November 18, 2005
    Date of Patent: May 10, 2011
    Assignee: Sony Corporation
    Inventor: Ayumi Senda
  • Publication number: 20080273096
    Abstract: Charging of a camera 100 and backup of data are concurrently executed to enable picking up an image regardless of a remaining available memory. As the camera 100 is attached to a cradle 200, image data for the image picked up by a camera module 110 of the camera 100 is directly transferred to and recorded in a HDD 220 of the cradle 200. Image data, already recorded in the flash memory 133 of the camera 100, is backed up by the HDD 220 of the cradle 200. Further, the cradle 200 allows a charging circuit 204 to charge a rechargeable battery of the camera 100 using electric power supplied via an AC cord 280. Also, the cradle 200 has a tripod bore 270 through which the camera is fixed to a tripod for picking up the image.
    Type: Application
    Filed: November 18, 2005
    Publication date: November 6, 2008
    Applicant: Sony Corporation
    Inventor: Ayumi Senda
  • Publication number: 20060177965
    Abstract: When a semiconductor chip is mounted on a mount substrate by bonding bumps, bonding failure is caused by misalignment between the bumps. Before a semiconductor chip having a plurality of bumps is mounted on a mount substrate (3) having a plurality of bumps (4) by flip chip bonding, a resist layer (5) having a thickness larger than that of the bumps (4) is formed on the mount substrate (3) with the bumps. By patterning the resist layer (5), projecting guides (5A) of semicircular cross section are formed on the mount substrate (3) so as to protrude near the bumps (4) and from a surface on which the bumps (4) are provided, and to have guide faces (curved faces) pointing toward the bumps (4).
    Type: Application
    Filed: January 14, 2004
    Publication date: August 10, 2006
    Inventor: Ayumi Senda