Abstract: Corrosion inhibitors for hypochlorous acid aqueous solutions are provided and impart corrosion inhibiting effects of suppressing the generation of rust in contacted metal surfaces to hypochlorous acid aqueous solutions. Effective components of the corrosion inhibitors comprise only: an A component composed of (A1) a metal salt of formic acid and/or (A2) a metal salt of saturated carboxylic acid, wherein the number n of carbon atoms contained in the molecule is at least 2, the valence v of the acid is 1 or 2, and the value n/v obtained by dividing the number n of carbon atoms by the valence v of the carboxylic acid is 2-6; and a B component composed of a nonionic surfactant, wherein the mass ratio B/A of the B component to the A component in the effective component is 0.005-10.0.

Abstract: A fuel oil “A” composition wherein the density (15C) is 0.8400 to 0.8900 g/cm3, the kinematic viscosity at 50 C is not less than 2.000 mm2/s and the cetane index (old) is not less than 35, and also wherein the sulphur content is not more than 0.100 mass %, the sulphur content of sulphur compounds having a boiling point at or above the boiling point of dibenzothiophene is not more than 110 mass ppm, and the residual carbon content of 10% residual oil is not less than 0.20 mass %.

Abstract: A method for producing a weakly acidic hypochlorous acid aqueous solution comprises (A) an ion-exchange step for generating molecular hypochlorous acid dissolved in a mixed solution by mixing a raw material aqueous solution composed of an aqueous solution of a metal salt of hypochlorous acid with an acidic ion-exchange resin to perform ion exchange between the metal ions and the hydrogen ions, and (B) a separation step for separating the acidic ion-exchange resin from the mixed solution after the ion-exchange step and obtaining weakly acidic hypochlorous acid aqueous solution in which molecular hypochlorous acid is dissolved.

Abstract: A fuel oil “A” composition wherein the density (15C) is 0.8400 to 0.8900 g/cm3, the kinematic viscosity at 50 C is not less than 2.000 mm2/s and the cetane index (old) is not less than 35, and also wherein the sulphur content is not more than 0.100 mass %, the sulphur content of sulphur compounds having a boiling point at or above the boiling point of dibenzothiophene is not more than 110 mass ppm, and the residual carbon content of 10% residual oil is not less than 0.20 mass %.

Abstract: There is provided an epoxy compound whose melt viscosity is low and which exhibits heat resistance and flame retardancy of a cured product; an epoxy resin which includes the same; curable composition and cured product; and semiconductor sealing material. The epoxy compound has a molecular structure represented by the following Formula (I): in the formula, G represents a glycidyl group, and X represents a structural site represented by the following Structural Formula (x1) or (x2); in Formula (x1) or (x2), k represents an integer of 1 to 3, m represents 1 or 2, Ar represents a structural site represented by the following Structural Formula (Ar1) or (Ar2), and when k or m represents 2 or greater, a plurality of Ar's may be the same as or different from each other: in Formula (3) or (4), G represents a glycidyl group, and p and r each independently represent 1 or 2.

Abstract: Provided are an epoxy resin which has high fluidity, a method for producing the epoxy resin, a cured product thereof, and a use thereof. The epoxy resin is represented by the structural formula (1) below and exhibits a peak P appearing between peaks with n=0 and n=1 in a GPC measurement in which the area of the peak P is 0.0100 to 0.0750 times the area of the peak with n=0, wherein G represents a glycidyl group, R1 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, a phenyl group, a hydroxyphenyl group, or a halogen-substituted phenyl group, symbol * indicates bonding to any of the carbon atoms capable of forming a bond on the naphthalene ring, and n represents the number of repeats and is 0 to 10 on average.

Abstract: There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I): wherein X is a structural site represented by the following Structural Formula (x1) or (x2); wherein, in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other; wherein r is 1 or 2.

Abstract: There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I): wherein X is a structural site represented by the following Structural Formula (x1) or (x2); in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other; wherein p is 1 or 2.

Abstract: There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The phenolic resin contains a binuclear compound (X) represented by the following Structural Formula (I), and a trinuclear compound (Y) represented by the following Structural Formula (II) as essential components: wherein each of j and k is 1 or 2, and at least one of j and k is 2; wherein each of l, m and n is 1 or 2, and at least one of l, m, and n is 2.

Abstract: There is provided an epoxy compound exhibiting excellent heat resistance and flame retardance of a cured product thereof; an epoxy resin containing the epoxy compound; a curable composition and a cured product thereof; and a semiconductor sealing material. The epoxy compound has a diarylene[b,d]furan structure, in which at least one of two arylene groups has a naphthylene skeleton and two arylene groups each include a glycidyloxy group on an aromatic nucleus thereof.

Abstract: There are provided a compound containing a phenolic hydroxyl group which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product, a phenolic resin including the same, a curable composition and a cured product thereof, and a semiconductor sealing material. The compound containing a phenolic hydroxyl group has a dinaphthofuran skeleton, in which each of the two naphthylene skeletons has a hydroxyl group on an aromatic nucleus thereof.

Abstract: There are provided a compound containing a phenolic hydroxyl group which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product, a phenolic resin including the same, a curable composition and a cured product thereof, and a semiconductor sealing material. The compound containing a phenolic hydroxyl group has a dinaphthofuran skeleton, in which each of the two naphthylene skeletons has a hydroxyl group on an aromatic nucleus thereof.

Abstract: There is provided an epoxy compound exhibiting excellent heat resistance and flame retardance of a cured product thereof; an epoxy resin containing the epoxy compound; a curable composition and a cured product thereof; and a semiconductor sealing material. The epoxy compound has a diarylene[b,d]furan structure, in which at least one of two arylene groups has a naphthylene skeleton and two arylene groups each include a glycidyloxy group on an aromatic nucleus thereof.

Abstract: There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The phenolic resin contains a binuclear compound (X) represented by the following Structural Formula (I), and a trinuclear compound (Y) represented by the following Structural Formula (II) as essential components: wherein each of j and k is 1 or 2, and at least one of j and k is 2; wherein each of l, m and n is 1 or 2, and at least one of l, m, and n is 2.

Abstract: There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I): wherein X is a structural site represented by the following Structural Formula (x1) or (x2); in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other; wherein p is 1 or 2.

Abstract: There is provided an epoxy compound whose melt viscosity is low and which exhibits heat resistance and flame retardancy of a cured product; an epoxy resin which includes the same; curable composition and cured product; and semiconductor sealing material. The epoxy compound has a molecular structure represented by the following Formula (I): in the formula, G represents a glycidyl group, and X represents a structural site represented by the following Structural Formula (x1) or (x2); in Formula (x1) or (x2), k represents an integer of 1 to 3, m represents 1 or 2, Ar represents a structural site represented by the following Structural Formula (Ar1) or (Ar2), and when k or m represents 2 or greater, a plurality of Ar's may be the same as or different from each other: in Formula (3) or (4), G represents a glycidyl group, and p and r each independently represent 1 or 2.

Abstract: There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I): wherein X is a structural site represented by the following Structural Formula (x1) or (x2); wherein, in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other; wherein r is 1 or 2.

Abstract: In a substrate carrying optical devices housed in a case, there are formed positioning parts for defining the positions of optical axes of the optical devices. Flexible optical waveguides are provided which are fixedly held at one end in the positioning parts and connected at the other end to an optical connector ferrule mounted in the case, and deviations from proper alignment between the optical axes of the optical devices and the axes of optical fiber receiving holes of the optical connector ferrule are accommodated by deformation of the flexible optical waveguides.

Abstract: In a substrate carrying optical devices housed in a case, there are formed positioning parts for defining the positions of optical axes of the optical devices. Flexible optical waveguides are provided which are fixedly held at one end in the positioning parts and connected at the other end to an optical connector ferrule mounted in the case, and deviations from proper alignment between the optical axes of the optical devices and the axes of optical fiber receiving holes of the optical connector ferrule are accommodated by deformation of the flexible optical waveguides.