Patents by Inventor Ayumi Tsuruoka

Ayumi Tsuruoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230104876
    Abstract: A lamination method, includes: a first coating step of applying any one of a main agent M and a curing agent H of a two-component curable adhesive as a coating liquid to a first web W1; a second coating step of applying the other one of the main agent M and the curing agent H as a coating liquid to a second web W2; and a bonding step of bonding a coating liquid-coated surface of the first web W1 and a coating liquid-coated surface of the second web W2, and of combining the main agent M and the curing agent H to increase a molecular weight. In addition, in the first coating step and the second coating step, the main agent M or the curing agent H is applied by a gravure coater.
    Type: Application
    Filed: March 16, 2021
    Publication date: April 6, 2023
    Applicant: DIC CORPORATION
    Inventors: Shigekazu Takahashi, Choichi Takada, Hidenobu Miura, Ayumi Tsuruoka