Abstract: The problem to be addressed by the invention is to provide a polymerizable composition for three-dimensional modeling used for producing three-dimensional models having high flexural modulus and impact strength, as well as high dimensional accuracy, and a production method for the composition. In order to solve the problem, the polymerizable composition for three-dimensional modeling contains an inorganic filler with an aspect ratio of 5 or greater, a dispersant, a photopolymerizable compound, and a thermally polymerizable compound.

Abstract: The purpose of the present invention is to provide a resin composition which is capable of producing a three-dimensional object having high tensile strength and dimensional accuracy and is easily detectable by a metal detector. The resin composition is used in a method in which a liquid-liquid type resin composition is selectively irradiated with an active energy ray to produce a three-dimensional object composed of a cured product of the resin composition. The resin composition contains a photopolymerizable compound and a metal-containing particle, which can be detected by a metal detector and has been surface-treated with a surfactant, the content of the metal-containing particle being 10-55 mass % with respect to the solid content of a resin.

Abstract: The present invention is aimed to provide a powder material for the powder bed fusion method, the powder material enabling higher modeling speed and higher manufacturing precision. The present invention relates to a powder material containing a plurality of composite particles. The composite particles contain metal base particles having a number average particle diameter of 20-60 ?m inclusive and low-heat-conductivity particles that adhere in an insular form to the surfaces of the base particles and that have a number average particle diameter of 100-300 nm inclusive. The heat conductivity of the low-heat-conductivity particles at 100° C. is 35.0 W/K·m or less, and the heat conductivity of the low-heat-conductivity particles at 100° C. is lower than the heat conductivity of a metal material at 100° C. contained as a main constituent of the metal base particles.

Abstract: The objective of the present invention is to provide a sealant for an LED device capable of forming a sealing layer having a high level of light extraction, outstanding resistance to sulfidizing gas, and not giving rise to cracking or peeling even when used for extended periods, as well as an LED device employing the same. In order to attain at least one of the abovementioned objective, a sealant for an LED device reflecting one aspect of the present invention contains 100 mass parts of a 1000-3000 mass average molecular weight polysiloxane polymerized from a trifunctional monomethyl silane compound and a tetrafunctional silane compound, 5 mass parts to 100 mass parts of an organometallic compound comprising a metal alkoxide or metal chelate containing a Group 4 or Group 13 metal, and a solvent.

Abstract: The film mirror has sequencial layers of a hard coat layer, a resin layer and a reflective layer. The hard coat layer has an absorber and the absorber is a triazine absorber or an inorganic UV absorber. Such a mirror has high specular reflectance without delamination even after long-term irradiation by sunlight because of the specific absorbers used in the hard coat layer.