Abstract: According to the present disclosure, an electronic apparatus comprises: a heat radiation member including a main body portion having a plate shape; an upper circuit board provided on a front surface portion of the main body portion; a lower circuit board provided on a rear surface portion of the main body portion; and a housing having a bottomed box shape in which the main body portion, the upper circuit board, and the lower circuit board are housed, wherein a guide portion is formed on the housing, and the guide portion guides the main body portion to a position in which contact between the lower circuit board and the housing is avoided when the main body portion is inserted from a through-hole of a wall surface portion of the housing into the housing in a state where the lower circuit board is attached to the main body portion.

Abstract: According to the present disclosure, an electronic apparatus comprises: a heat radiation member including a main body portion having a plate shape; an upper circuit board provided on a front surface portion of the main body portion; a lower circuit board provided on a rear surface portion of the main body portion; and a housing having a bottomed box shape in which the main body portion, the upper circuit board, and the lower circuit board are housed, wherein a guide portion is formed on the housing, and the guide portion guides the main body portion to a position in which contact between the lower circuit board and the housing is avoided when the main body portion is inserted from a through-hole of a wall surface portion of the housing into the housing in a state where the lower circuit board is attached to the main body portion.

Abstract: Provided is a heat-dissipating structure having a heat-dissipating path that enables efficient dissipation of heat. An electronic device (100) comprises: a substrate (1); a heat-generating component (2) mounted on the substrate (1); a case (3) attached to the substrate (1) and having a shape at least partially covering the heat-generating component (2); and a heat-dissipating member (4) thermally connected to the case (3). The substrate (1) has a filled-via group (12). The filled-via group (12) is disposed across: a first region (A1) including a region in which the heat-generating component (2) contacts the substrate (1); a second region (A2) including a region in which the case (3) contacts the substrate (1); and a third region (A3) including a region between the first region (A1) and the second region (A2). The filled-via group (12) forms a heat-dissipating path from the heat-generating component (2) to the case (3).