Abstract: The invention provides a curable resin composition having low weight reduction ratio during heat curing for obtaining a cured product having high heat resistance, but having reduced mold shrinkage ratio and coefficient of thermal expansion, a cured product thereof, and a method of producing the curable resin composition and the cured product. Also provided is a semiconductor device using the product as a sealant. The curable resin composition includes: (A) a benzoxazine compound; (B) an epoxy compound; and (C) a phenolic curing agent, wherein the number of epoxy groups in the (B) epoxy compound, the number of benzoxazine rings in the (A) benzoxazine compound, and the number of hydroxyl groups in the (C) phenolic curing agent satisfy the mathematical formula (1), and the content of the (B) alicyclic epoxy compound is 3 to 12 mass % with respect to the total of the (A), (B), and (C).

Abstract: A prepreg comprising: carbon fibers; and a resin composition containing an epoxy resin having a biphenyl structure, a curing agent, and melamine cyanurate.

Abstract: A prepreg comprising: carbon fibers; and a resin composition containing an epoxy resin having a biphenyl structure, a curing agent, and melamine cyanurate.

Abstract: Method for producing carboxylic anhydride, the method includes heating raw material compound represented by the following general formula (1): [in the formula (1), R1 is tetravalent organic group having at least two carbon atoms adjacent to each other, and groups represented by the formulae: —COOR2 and —COOR3 are bonded to one and the other of the two adjacent carbon atoms, respectively, R2 and R3 each represent hydrogen atom or the like, X represents hydrogen atom or the like, and Y represents hydrogen atom or the like] in carboxylic acid having 1 to 5 carbon atoms with catalyst being used, to thereby obtain the carboxylic anhydride, wherein the catalyst is homogeneous acid catalyst having acid dissociation constant (pKa) of ?6.5 or lower and boiling point of 100° C. or higher, the acid dissociation constant (pKa) being determined by quantum chemistry calculation based on density functional method.

Abstract: The present invention can provide a methacrylic resin which has excellent transparency and color and less defects such as fish eyes and thus suitable for optical films by adding (A) a polymeric dispersant represented by formula (1) below and (B) an inorganic salt and/or organic salt selected from alkali metal salts, alkaline earth metal salts and ammonium salts when methyl methacrylate alone or a monomer mixture containing methyl methacrylate as one component is subjected to suspension-polymerization: (n=10 to 60 mol %, m=40 to 90 mol %, R1 is hydrogen or a methyl group, R2 is an alkyl group having 1 to 8 carbon atoms, and M is an alkali metal or alkaline earth metal or NH4.

Abstract: The present invention can provide a methacrylic resin which has excellent transparency and color and less defects such as fish eyes and thus suitable for optical films by adding (A) a polymeric dispersant represented by formula (1) below and (B) an inorganic salt and/or organic salt selected from alkali metal salts, alkaline earth metal salts and ammonium salts when methyl methacrylate alone or a monomer mixture containing methyl methacrylate as one component is subjected to suspension-polymerization: (n=10 to 60 mol %, m=40 to 90 mol %, R1 is hydrogen or a methyl group, R2 is an alkyl group having 1 to 8 carbon atoms, and M is an alkali metal or alkaline earth metal or NH4.