Patents by Inventor Ayumu SHIMAMIYA

Ayumu SHIMAMIYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THREE-DIMENSIONAL CIRCUIT BOARD AND SOLDER RESIST COMPOSITION USED FOR SAME
    Publication number: 20160360621
    Abstract: A three-dimensional circuit board which can prevent solder flow during component mounting or a short in a circuit, and a solder resist composition used for the same. The three-dimensional circuit board includes a circuit formed on a three-dimensional board and a component mount unit. A solder resist is formed such that a component mount unit is open, and an electronic component is mounted on a component mount unit with solder. The solder resist can be a photoresist, and the three-dimensional board can be a resin molding with a circuit formed on the resin molding.
    Type: Application
    Filed: January 14, 2015
    Publication date: December 8, 2016
    Applicant: TAIYO INK MFG. CO., LTD.
    Inventors: Ayumu SHIMAMIYA, Naoki YONEDA, Shigeru USHIKI