Patents by Inventor Ayush Tripathi

Ayush Tripathi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Spacer layer arrangements for light-emitting diodes
    Patent number: 11552229
    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LEDs and packaged LED devices with spacer layer arrangements are disclosed. An LED package may include one or more LED chips on a submount with a light-altering material arranged to redirect light in a desired emission direction with increased efficiency. A spacer layer is arranged in the LED package to cover rough surfaces and any gaps that may be formed between adjacent LED chips. When the light-altering material is applied to the LED package, the spacer layer provides a surface that reduces unintended propagation of the light-altering material toward areas of the LED package that would interfere with desired light emissions, for example over LED chips and between LED chips. In various arrangements, the spacer layer may cover one or more surfaces of a lumiphoric material, one or more LED chip surfaces, and portions of an underlying submount.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: January 10, 2023
    Assignee: CreeLED, Inc.
    Inventors: Kyle Damborsky, Ayush Tripathi, Robert Wilcox, Sarah Trinkle, Colin Blakely
  • SPACER LAYER ARRANGEMENTS FOR LIGHT-EMITTING DIODES
    Publication number: 20220085258
    Abstract: Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly LEDs and packaged LED devices with spacer layer arrangements are disclosed. An LED package may include one or more LED chips on a submount with a light-altering material arranged to redirect light in a desired emission direction with increased efficiency. A spacer layer is arranged in the LED package to cover rough surfaces and any gaps that may be formed between adjacent LED chips. When the light-altering material is applied to the LED package, the spacer layer provides a surface that reduces unintended propagation of the light-altering material toward areas of the LED package that would interfere with desired light emissions, for example over LED chips and between LED chips. In various arrangements, the spacer layer may cover one or more surfaces of a lumiphoric material, one or more LED chip surfaces, and portions of an underlying submount.
    Type: Application
    Filed: September 14, 2020
    Publication date: March 17, 2022
    Inventors: Kyle Damborsky, Ayush Tripathi, Robert Wilcox, Sarah Trinkle, Colin Blakely
  • Light emitting diode package
    Patent number: D1000400
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: October 3, 2023
    Assignee: CreeLED, Inc.
    Inventors: Robert Wilcox, Sarah Trinkle, Kyle Damborsky, Colin Blakely, Ayush Tripathi