Patents by Inventor AZDHAR DAHALAN

AZDHAR DAHALAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGED IC HAVING PRINTED DIELECTRIC ADHESIVE ON DIE PAD
    Publication number: 20140327123
    Abstract: A packaged integrated circuit (IC) includes a leadframe having metal terminals positioned outside the die pad. An IC die having a top side including a plurality of bond pads is placed with its bottom side onto attached by a dielectric polymer material to the die pad. Bond wires are between the plurality of bond pads and the metal terminals of the leadframe. A mold material different from said dielectric polymer material provides encapsulation for the packaged IC. An area of the dielectric polymer material exceeds an area of the IC die. The dielectric polymer material forms a dielectric polymer/mold material interface with the mold material.
    Type: Application
    Filed: July 15, 2014
    Publication date: November 6, 2014
    Inventors: WAN MOHD MISUARI SULEIMAN, AZDHAR DAHALAN
  • Packaged IC having printed dielectric adhesive on die pad
    Patent number: 8822274
    Abstract: A method of assembling a packaged integrated circuit (IC) includes printing a viscous dielectric polymerizable material onto a die pad of a leadframe having metal terminals positioned outside the die pad. An IC die having a top side including a plurality of bond pads is placed with its bottom side onto the viscous dielectric polymerizable material. Bond wires are wire bonded between the plurality of bond pads and the metal terminals of the leadframe.
    Type: Grant
    Filed: October 4, 2012
    Date of Patent: September 2, 2014
    Assignee: Texas Instruments Incorporated
    Inventors: Wan Mohd Misuari Suleiman, Azdhar Dahalan
  • PACKAGED IC HAVING PRINTED DIELECTRIC ADHESIVE ON DIE PAD
    Publication number: 20140097526
    Abstract: A method of assembling a packaged integrated circuit (IC) includes printing a viscous dielectric polymerizable material onto a die pad of a leadframe having metal terminals positioned outside the die pad. An IC die having a top side including a plurality of bond pads is placed with its bottom side onto the viscous dielectric polymerizable material. Bond wires are wire bonded between the plurality of bond pads and the metal terminals of the leadframe.
    Type: Application
    Filed: October 4, 2012
    Publication date: April 10, 2014
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: WAN MOHD MISUARI SULEIMAN, AZDHAR DAHALAN