Abstract: A computer-implemented method for authentication of a queried device having an electrical circuit exhibiting physically unclonable functions (PUFs). The method includes: at the queried device, generating a first random number based on an initial first counter value; matching the first random number against a first value of a record stored in a database of a querying device, the record including second (shuffled) and third values; at the queried device, generating a second random number based on a once incremented first counter value, deterministically generating a de-shuffled second value based on an initial second counter value, determining that the second random number matches the de-shuffled second value, and submitting sub-challenges corresponding to the second random number to the electrical circuit to generate a response; and, at the querying device, determining that the response matches the third value of the record to complete a first authentication of the queried device.

Abstract: Low-resource overhead computer-implemented methods for enrolling, authenticating and establishing encryption keys for one or more queried devices, each of the queried devices including an electrical circuit configured to output electrical signals indica-five of a physically unclonable function (PUF) of the queried device. Authentication and encryption are implemented in low-resource queried device computational architectures, with embodiments of the present invention utilizing pseudo-random number generators configured based on unique primitive polynomials, masking and unmasking functions, and error correction protocols executed in a querying device.

Abstract: A computer-implemented method for authentication of a queried device having an electrical circuit exhibiting physically unclonable functions (PUFs). The method includes: at the queried device, generating a first random number based on an initial first counter value; matching the first random number against a first value of a record stored in a database of a querying device, the record including second (shuffled) and third values; at the queried device, generating a second random number based on a once incremented first counter value, deterministically generating a de-shuffled second value based on an initial second counter value, determining that the second random number matches the de-shuffled second value, and submitting sub-challenges corresponding to the second random number to the electrical circuit to generate a response; and, at the querying device, determining that the response matches the third value of the record to complete a first authentication of the queried device.

Abstract: A reflow apparatus for solder joining electronic components to a substrate includes a reflow chamber, a conveyor to convey a substrate within the chamber, at least one heating element to provide heat to reflow solder on the substrate, and at least one system to remove contaminants generated from the reflow solder. The system is coupled with the chamber for passage of a vapor stream from the chamber through the system. The system comprises a contaminant collection unit in fluid communication with the vapor stream. The contaminant collection unit includes a coil and a collection container. The coil is configured to receive cooled gas therein. The arrangement is such that when introducing cooled gas in the coil, contaminants in the vapor stream condense on the coil, and when ceasing the introduction of cooled gas in the coil, contaminants in the vapor stream are released from the coil and collected in the collection container. Other embodiments and methods for removing contaminants are further disclosed.

Abstract: A reflow apparatus for solder joining electronic components to a substrate includes a reflow chamber, a conveyor to convey a substrate within the chamber, at least one heating element to provide heat to reflow solder on the substrate, and at least one system to remove contaminants generated from the reflow solder. The system is coupled with the chamber for passage of a vapor stream from the chamber through the system. The system comprises a contaminant collection unit in fluid communication with the vapor stream. The contaminant collection unit includes a coil and a collection container. The coil is configured to receive cooled gas therein. The arrangement is such that when introducing cooled gas in the coil, contaminants in the vapor stream condense on the coil, and when ceasing the introduction of cooled gas in the coil, contaminants in the vapor stream are released from the coil and collected in the collection container. Other embodiments and methods for removing contaminants are further disclosed.

Abstract: A reflow apparatus for solder joining electronic components to a substrate includes a reflow chamber, a conveyor to convey a substrate within the chamber, at least one heating element to provide heat to reflow solder on the substrate, and at least one system to remove contaminants generated from the reflow solder. The system is coupled with the chamber for passage of a vapor stream from the chamber through the system. The system comprises a contaminant collection unit in fluid communication with the vapor stream. The contaminant collection unit includes a coil and a collection container. The coil is configured to receive cooled gas therein. The arrangement is such that when introducing cooled gas in the coil, contaminants in the vapor stream condense on the coil, and when ceasing the introduction of cooled gas in the coil, contaminants in the vapor stream are released from the coil and collected in the collection container. Other embodiments and methods for removing contaminants are further disclosed.

Abstract: A reflow apparatus for solder joining electronic components to a substrate includes a reflow chamber, a conveyor to convey a substrate within the chamber, at least one heating element to provide heat to reflow solder on the substrate, and at least one system to remove contaminants generated from the reflow solder. The system is coupled with the chamber for passage of a vapor stream from the chamber through the system. The system comprises a contaminant collection unit in fluid communication with the vapor stream. The contaminant collection unit includes a coil and a collection container. The coil is configured to receive cooled gas therein. The arrangement is such that when introducing cooled gas in the coil, contaminants in the vapor stream condense on the coil, and when ceasing the introduction of cooled gas in the coil, contaminants in the vapor stream are released from the coil and collected in the collection container. Other embodiments and methods for removing contaminants are further disclosed.

Abstract: A reflow apparatus for solder joining electronic components to a substrate includes a reflow chamber, a conveyor to convey a substrate within the chamber, at least one heating element to provide heat to reflow solder on the substrate, and at least one system to remove contaminants generated from the reflow solder. The system is coupled with the chamber for passage of a vapor stream from the chamber through the system. The system comprises a contaminant collection unit in fluid communication with the vapor stream. The contaminant collection unit includes a coil and a collection container. The coil is configured to receive cooled gas therein. The arrangement is such that when introducing cooled gas in the coil, contaminants in the vapor stream condense on the coil, and when ceasing the introduction of cooled gas in the coil, contaminants in the vapor stream are released from the coil and collected in the collection container. Other embodiments and methods for removing contaminants are further disclosed.