Abstract: A process and system for effecting addition and/or subtraction any two symbols having any number of characters and in any base with full precision and without first converting to a common base. Regardless of the quantity of characters of each symbol, the speed of execution remains almost constant per character. The process and system of the present invention does not require the use of floating point notation. Furthermore, the process and system of the present invention does not require or use standard mathematical algorithms, addition or subtraction tables, or exponentiation.

Abstract: A process and system for effecting addition and/or subtraction any two symbols having any number of characters and in any base with full precision and without first converting to a common base. Regardless of the quantity of characters of each symbol, the speed of execution remains almost constant per character. The process and system of the present invention does not require the use of floating point notation. Furthermore, the process and system of the present invention does not require or use standard mathematical algorithms, addition or subtraction tables, or exponentiation.

Abstract: The present invention relates generally to a new apparatus and a method for a high-efficiency in-situ vacuum particle detection. More particularly, the invention encompasses an apparatus for a particle detecting instrument designed to detect the presence of gas-borne particles in a vacuum line with high efficiency, using a sharply converging nozzle to preferentially focus the suspended particles flowing through it into a small region located on the nozzle axis within a few exit dimensions downstream from the nozzle exit. This focal region has a dimension much smaller than that of the nozzle exit, and is illuminated by a narrow, intense light beam. The particles passing through the illuminated focal region are detected by photodetector elements receiving light scattered from the particles. A method and an apparatus for high-efficiency, in-situ particle separation and/or measurement is also disclosed.

Abstract: The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.

Abstract: The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.