Abstract: The invention relates to a method for producing a graphene sheet on a platinum silicide, wherein the platinum silicide is in the form of a layer or a plurality of pins. This method comprises: a) producing a stack by (i) depositing a layer C1 of a diffusion barrier material on a substrate; (ii) depositing, on the layer C1, a layer C2 of a carbon-containing material, wherein said carbon-containing material optionally comprises silicon; (iii) depositing, on the layer C2, a layer C3 of platinum; (iv) depositing a layer C4 of a material of formula SiaCbHc on the layer C3 if the carbon-containing material of the layer C2 is free from silicon; and b) heat-treating the stack obtained at step a). It also relates to structures obtained using this method and the uses of these structures. Applications: manufacture of micro- and nanoelectronic devices, micro- and nanoelectromechanical devices, etc.

Abstract: A structure, method of manufacturing a structure, and methods of using a structure including a graphene sheet is disclosed. According to one aspect, the grapheme sheet is provided, on one of the faces of the structure, with a plurality of metal pins. The metal pins being separated from one another by a dielectric medium chosen from air and dielectric materials. The method including the steps of synthesizing, by vapor phase catalytic growth, the graphene sheet on a plurality of metal pins that are disposed on a membrane made from dielectric material or integrated in the membrane. The growth being catalyzed by the metal pins. According to some aspects, the membrane is removed from the structure. The structure may be used, for example, in the fields of micro- and nanoelectronics, micro- and nanoelectronic engineering, spintronics, photovoltaics, light emitting diode display, or the like.

Abstract: The present invention relates to a method of production of graphene comprising the following stages respectively: a stage of deposition of a thin layer comprising amorphous carbon on a substrate; a stage of annealing of said thin layer under photonic and/or electronic irradiation, by which a layer comprising graphene is obtained.

Abstract: Provided a method for producing an oriented-porosity dielectric material on a substrate. The method includes depositing a composite layer on a substrate by vapor deposition comprising a material forming a matrix and a compound comprising chemical groups capable of being oriented under the effect of an electromagnetic field and/or photonic radiation; treating the composite layer to obtain the cross-linking of the material forming a matrix; and subjecting the substrate coated with the composite layer to an electromagnetic field and a photonic radiation.

Abstract: A process for producing at least one air gap in a microstructure, which includes the supply of a microstructure comprising at least one gap filled with a sacrificial material, this gap being limited over at least part of its surface by an impermeable membrane but which may be rendered permeable by the action of a chemical etchant, this etchant also being capable of degrading the sacrificial material and the contacting of the microstructure with said chemical etchant in order to make the membrane permeable and degrade the sacrificial material, and the removal of the chemical etchant from the microstructure and in which the chemical etchant is a fluid containing hydrofluoric acid and/or ammonium fluoride. Applications include microelectronics and micro-technology.

Abstract: Provided a method for producing an oriented-porosity dielectric material on a substrate. The method includes depositing a vapor phase on a substrate of a composite layer comprising a material forming a matrix and a compound comprising chemical groups capable of being oriented under the effect of an electromagnetic field and/or photonic radiation; treating the composite layer to obtain the cross-linking of the material forming a matrix; and subjecting the substrate coated with the composite layer to an electromagnetic field and/or a photonic radiation.

Abstract: Provided a method for producing an oriented-porosity dielectric material on a substrate. The method includes depositing a vapor phase on a substrate of a composite layer comprising a material forming a matrix and a compound comprising chemical groups capable of being oriented under the effect of an electromagnetic field and/or photonic radiation; treating the composite layer to obtain the cross-linking of the material forming a matrix; and subjecting the substrate coated with the composite layer to an electromagnetic field and/or a photonic radiation.

Abstract: A structure, method of manufacturing a structure, and methods of using a structure including a graphene sheet is disclosed. According to one aspect, the grapheme sheet is provided, on one of the faces of the structure, with a plurality of metal pins. The metal pins being separated from one another by a dielectric medium chosen from air and dielectric materials. The method including the steps of synthesizing, by vapor phase catalytic growth, the graphene sheet on a plurality of metal pins that are disposed on a membrane made from dielectric material or integrated in the membrane. The growth being catalysed by the metal pins. According to some aspects, the membrane is removed from the structure. The structure may be used, for example, in the fields of micro- and nanoelectronics, micro- and nanoelectronic engineering, spintronics, photovoltaics, light emitting diode display, or the like.

Abstract: A process for producing at least one air gap in a microstructure, including supplying a microstructure having at least one gap filled with a sacrificial material that decomposes starting from a temperature ?1, this gap being delimited over at least one part of its surface by a non-porous membrane, composed of a material that forms a matrix and of a pore-forming agent that decomposes at a temperature ?2<?1 by at least 20° C. and that is dispersed in this matrix, then treating the microstructure at a temperature ??2 but <?1 in order to selectively decompose the pore-forming agent, then treating the microstructure at a temperature ??1 in order to decompose the sacrificial material.

Abstract: A process for fabricating a hydrogenated amorphous silicon carbide film having through-pores includes the formation on a substrate of a film consisting of an amorphous hydrogenated silicon carbide matrix in which silicon oxide nanowires are dispersed therethrough, and then the selective destruction by a chemical agent of the silicon oxide nanowires present in the film formed at step a). Applications include microelectronics and micro-technology, in all fabrication processes that involve the degradation of a sacrificial material by diffusion of a chemical agent through a film permeable to this agent for the production of air gaps, in particular the fabrication of air-gap interconnects for integrated circuits.

Abstract: The present invention relates to a method of production of graphene comprising the following stages respectively: a stage of deposition of a thin layer comprising amorphous carbon on a substrate; a stage of annealing of said thin layer under photonic and/or electronic irradiation, by which a layer comprising graphene is obtained.

Abstract: The invention relates to a process for producing at least one air gap in a microstructure, which comprises: 1) the supply of a microstructure comprising at least one gap filled with a sacrificial material that decomposes starting from a temperature ?1, this gap being delimited over at least one part of its surface by a non-porous membrane, composed of a material that forms a matrix and of a pore-forming agent that decomposes at a temperature ?2<?1 by at least 20° C. and that is dispersed in this matrix; 2) the treatment of the microstructure at a temperature ??2 but <?1 in order to selectively decompose the pore-forming agent; then 3) the treatment of the microstructure at a temperature ??1 in order to decompose the sacrificial material. Applications: fabrication of air-gap interconnect structures for integrated circuits and of any other microstructure in the microelectronics and microtechnology industries.

Abstract: The invention relates to a process for producing at least one air gap in a microstructure, which comprises: 1) the supply of a microstructure comprising at least one gap filled with a sacrificial material that decomposes starting from a temperature ?1, this gap being delimited over at least one part of its surface by a non-porous membrane, composed of a material that forms a matrix and of a pore-forming agent that decomposes at a temperature ?2<?1 by at least 20° C. and that is dispersed in this matrix; 2) the treatment of the microstructure at a temperature ??2 but <?1 in order to selectively decompose the pore-forming agent; then 3) the treatment of the microstructure at a temperature ??1 in order to decompose the sacrificial material. Applications: fabrication of air-gap interconnect structures for integrated circuits and of any other microstructure in the microelectronics and microtechnology industries.

Abstract: The invention relates to a process for producing at least one air gap in a microstructure, which comprises: a) the supply of a microstructure comprising at least one gap filled with a sacrificial material, this gap being limited over at least part of its surface by an impermeable membrane but which may be rendered permeable by the action of a chemical etchant, this etchant also being capable of degrading the sacrificial material; b) the contacting of the microstructure with said chemical etchant in order to make the membrane permeable and degrade the sacrificial material; and c) the removal of the chemical etchant from the microstructure; and in which the chemical etchant is a fluid containing hydrofluoric acid and/or ammonium fluoride. Applications: Microelectronics and micro-technology.

Abstract: The invention relates to a process for fabricating a hydrogenated amorphous silicon carbide film having through-pores, which comprises: a) the formation on a substrate of a film consisting of an amorphous hydrogenated silicon carbide matrix in which silicon oxide through-nanowires are dispersed; and then b) the selective destruction by a chemical agent of the silicon oxide nanowires present in the film formed at step a). Applications: microelectronics and micro-technology, in all fabrication processes that involve the degradation of a sacrificial material by diffusion of a chemical agent through a film permeable to this agent for the production of air gaps, in particular the fabrication of air-gap interconnects for integrated circuits.