Abstract: A semiconductor device includes a semiconductor package, including a package body that includes an encapsulant portion and an isolation structure, a semiconductor die embedded within the package body, and a plurality of leads that protrude out from the encapsulant body, wherein the encapsulant portion and the isolation structure are each electrically insulating structures, wherein the isolation structure has a greater thermal conductivity than the encapsulant portion, and wherein the isolation structure is thermally coupled to the semiconductor die, and a releasable layer affixed to the semiconductor package, wherein a first outer face of the package body includes a first surface of the isolation structure, wherein the releasable layer at least partially covers the first surface of the isolation structure, and wherein the releasable layer is releasable from the semiconductor package.

Abstract: A semiconductor device includes a semiconductor package, including a package body that includes an encapsulant portion and an isolation structure, a semiconductor die embedded within the package body, and a plurality of leads that protrude out from the encapsulant body, wherein the encapsulant portion and the isolation structure are each electrically insulating structures, wherein the isolation structure has a greater thermal conductivity than the encapsulant portion, and wherein the isolation structure is thermally coupled to the semiconductor die, and a releasable layer affixed to the semiconductor package, wherein a first outer face of the package body includes a first surface of the isolation structure, wherein the releasable layer at least partially covers the first surface of the isolation structure, and wherein the releasable layer is releasable from the semiconductor package.

Abstract: A semiconductor package is disclosed. In one example, the semiconductor package includes a package body. A first diepad is at least partially uncovered by the package body at the first main surface. A second diepad is at least partially uncovered by the package body at the first main surface. A first semiconductor chip is arranged on the first diepad. A second semiconductor chip is arranged on the second diepad. The semiconductor package further includes at least one lead protruding out of the package body at the side surface. A first groove is formed in the first main surface, wherein the first groove is arranged between the first diepad and the second diepad, and a second groove is formed in the first main surface, wherein the second groove is arranged between the at least one lead and at least one of the first diepad and the second diepad.

Abstract: A semiconductor device includes a semiconductor package, including a package body that includes an encapsulant portion and an isolation structure, a semiconductor die embedded within the package body, and a plurality of leads that protrude out from the encapsulant body, wherein the encapsulant portion and the isolation structure are each electrically insulating structures, wherein the isolation structure has a greater thermal conductivity than the encapsulant portion, and wherein the isolation structure is thermally coupled to the semiconductor die, and a releasable layer affixed to the semiconductor package, wherein a first outer face of the package body includes a first surface of the isolation structure, wherein the releasable layer at least partially covers the first surface of the isolation structure, and wherein the releasable layer is releasable from the semiconductor package.

Abstract: An interconnect clip includes a die attach pad that comp includes rises a die attach surface at an inner side of the interconnect clip, a heat dissipation pad that includes a heat dissipation surface at an outer side of the interconnect clip, and a lead contact pad that includes a lead contact surface at an inner side of the interconnect clip or at an outer side of the interconnect clip. The outer side of the interconnect clip in the lead contact pad faces and is spaced apart from the inner side of the interconnect clip in the heat dissipation pad, and the inner side of the interconnect clip in the lead contact pad faces and is spaced apart from the outer side of the interconnect clip in the die attach pad.

Abstract: A semiconductor package includes a die pad having a die attach surface, a rear surface opposite the die attach surface, and an outer edge side extending between the die attach surface and the rear surface, the outer edge side having a step-shaped profile, wherein an upper section of the die pad laterally overhangs past a lower section of the die pad, a semiconductor die mounted on the die attach surface and having a first electrical terminal on an upper surface of the semiconductor die, and a first conductive clip that directly electrically contacts the first electrical terminal and wraps around the outer edge side of the die pad such that a section of the first conductive clip is at least partially within an area that is directly below the upper section of the die pad and directly laterally adjacent to the lower section.

Abstract: A semiconductor package includes a die pad having a die attach surface, a rear surface opposite the die attach surface, and an outer edge side extending between the die attach surface and the rear surface, the outer edge side having a step-shaped profile, wherein an upper section of the die pad laterally overhangs past a lower section of the die pad, a semiconductor die mounted on the die attach surface and having a first electrical terminal on an upper surface of the semiconductor die, and a first conductive clip that directly electrically contacts the first electrical terminal and wraps around the outer edge side of the die pad such that a section of the first conductive clip is at least partially within an area that is directly below the upper section of the die pad and directly laterally adjacent to the lower section.

Abstract: A leadframe, that is to be incorporated into a semiconductor housing is provided. The leadframe may include a first die pad, a second die pad and a plurality of contact pads. A lower surface of the contact pads and a lower surface of the first die pad are arranged in a first plane. An upper surface of the second die pad is arranged in a second plane distant from the first plane by an overall thickness of the semiconductor package.

Abstract: A leadframe, that is to be incorporated into a semiconductor housing is provided. The leadframe may include a first die pad, a second die pad and a plurality of contact pads. A lower surface of the contact pads and a lower surface of the first die pad are arranged in a first plane. An upper surface of the second die pad is arranged in a second plane distant from the first plane by an overall thickness of the semiconductor package.