Patents by Inventor Azlina N. Nayan

Azlina N. Nayan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip package fixture
    Patent number: 8017434
    Abstract: Various methods and apparatus for holding a semiconductor chip package are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first plate adapted to hold a semiconductor chip package. The semiconductor chip package includes a carrier substrate and at least one semiconductor chip coupled to the carrier substrate. A second plate is formed with a first opening defining an interior peripheral surface adapted to compress an outer edge of the carrier substrate between the first plate and the second plate without engaging the at least one semiconductor chip.
    Type: Grant
    Filed: November 24, 2008
    Date of Patent: September 13, 2011
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Kevin W. Lim, Seah S. Too, Azlina N. Nayan, Kee Hean Keok, Soon Tatt Ow Yong
  • Semiconductor Chip Package Fixture
    Publication number: 20100129959
    Abstract: Various methods and apparatus for holding a semiconductor chip package are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first plate adapted to hold a semiconductor chip package. The semiconductor chip package includes a carrier substrate and at least one semiconductor chip coupled to the carrier substrate. A second plate is formed with a first opening defining an interior peripheral surface adapted to compress an outer edge of the carrier substrate between the first plate and the second plate without engaging the at least one semiconductor chip.
    Type: Application
    Filed: November 24, 2008
    Publication date: May 27, 2010
    Inventors: Kevin W. Lim, Seah S. Too, Azlina N. Nayan, Kee Hean Keok, Soon Tatt Ow Yong