Patents by Inventor Azniza Binti Abd Aziz

Azniza Binti Abd Aziz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Via structure
    Publication number: 20080067665
    Abstract: In one embodiment, the invention may include a semiconductor package substrate with a plated-through hole (PTH) via. One or more conduits for transmitting signals can be located in the PTH via. The PTH via may shield the signals in the conduits from environmental noise (e.g., EMI). Other embodiments are described and claimed.
    Type: Application
    Filed: September 20, 2006
    Publication date: March 20, 2008
    Inventors: Azniza Binti Abd Aziz, Chan Kim Lee, Kuen Yew Lam