Abstract: An apparatus is disclosed comprising first printed circuit board—PCB—and second PCB structure each having a first surface and a second surface and a layer of electrically conductive material on the first surface thereof and being attached to each other in a substantially parallel configuration. A stripline is positioned between the two PCBs. Each one of the first PCB and the second PCB has a plurality of via-holes that are electrically conductive and are connected at one end to the layer of electrically conductive material on the first surface and to an electrically conductive pad on the second surface of the PCB. At least a first electrically conductive pad associated with the first PCB is located in proximity with a first electrically conductive pad associated with the second PCB thereby forming a capacitive configuration.

Abstract: An apparatus including a first antenna array including first radiators arranged at a plurality of vertices defining a first shape; and a second antenna array including second radiators arranged at a plurality of vertices defining a second shape, wherein a first subset and a second subset of the first radiators are configured to operate at different polarizations, wherein a first subset and a second subset of the second radiators are configured to operate at different polarizations, and wherein the first shape and the second shape partially overlap, wherein a radiator of the first radiators is within an area defined by the second shape, and one or more other radiators of the first radiators are outside the area defined by the second shape.

Abstract: An apparatus is disclosed comprising first printed circuit board—PCB—and second PCB structure each having a first surface and a second surface and a layer of electrically conductive material on the first surface thereof and being attached to each other in a substantially parallel configuration. A stripline is positioned between the two PCBs. Each one of the first PCB and the second PCB has a plurality of via-holes that are electrically conductive and are connected at one end to the layer of electrically conductive material on the first surface and to an electrically conductive pad on the second surface of the PCB. At least a first electrically conductive pad associated with the first PCB is located in proximity with a first electrically conductive pad associated with the second PCB thereby forming a capacitive configuration.