Abstract: The present disclosure discloses a distributed system. The distributed system includes a plurality of radio heads and a plurality of controllers disposed in one or more chassis external to the plurality of radio heads. Each of the plurality of controllers includes a baseband unit (BBU), an uplink time-division multiplexing (TDM) switch and a downlink TDM switch. The uplink TDM switch and the downlink TDM switch forward data bits between a radio head and a BBU by using TDM cells which may reduce latency relative to using Ethernet frames.

Abstract: The present disclosure discloses a distributed system. The distributed system includes a plurality of radio heads and a plurality of controllers disposed in one or more chassis external to the plurality of radio heads. Each of the plurality of controllers includes a baseband unit (BBU), an uplink time-division multiplexing (TDM) switch and a downlink TDM switch. The uplink TDM switch and the downlink TDM switch forward data bits between a radio head and a BBU by using TDM cells which may reduce latency relative to using Ethernet frames.

Abstract: The present disclosure discloses a distributed system. The distributed system includes a plurality of radio heads and a plurality of controllers disposed in one or more chassis external to the plurality of radio heads. Each of the plurality of controllers includes a baseband unit (BBU), an uplink time-division multiplexing (TDM) switch and a downlink TDM switch. The uplink TDM switch and the downlink TDM switch forward data bits between a radio head and a BBU by using TDM cells which may reduce latency relative to using Ethernet frames.

Abstract: The present disclosure discloses a distributed system. The distributed system includes a plurality of radio heads and a plurality of controllers disposed in one or more chassis external to the plurality of radio heads. Each of the plurality of controllers includes a baseband unit (BBU), an uplink time-division multiplexing (TDM) switch and a downlink TDM switch. The uplink TDM switch and the downlink TDM switch forward data bits between a radio head and a BBU by using TDM cells which may reduce latency relative to using Ethernet frames.

Abstract: A highly granular voltage regulator is disclosed. The voltage regulator circuit includes first and second current mirror circuits coupled to first and second control circuits, respectively. The voltage regulator circuit further includes an amplifier having an inverting input and a non-inverting input. The first current mirror circuit is coupled to the non-inverting input, whereas the second current mirror circuit is coupled to the inverting input. The first control circuit is operable to control a current provided by the first current mirror circuit, while the second control circuit is operable to control a current provided by the second current mirror circuit.

Abstract: An embodiment integrates non-PCI compliant devices with PCI compliant operating systems. A fabric system mimics the behavior of PCI. When non-PCI compliant devices do not know how to respond to PCI enumeration, embodiments provide a PCI enumeration reply and thus emulate a reply that would typically come from a PCI compliant device during emulation. Embodiments allow system designers to incorporate non-standard fabric structures with the benefit of still using robust and mature PCI infrastructure found in modern PCI compliant operating systems. More generally, embodiments allow an operating system compliant with a first standard (but not a second standard) to discover and communicate with a device that is non-compliant with the first standard (but possibly is compliant with the second standard). Other embodiments are described herein.

Abstract: Methods and apparatus for integrating ARM-based IPs in computer system employing PCI-based fabrics. An PCI-based fabric is operatively coupled to an ARM-based ecosystem employing an ARM-based fabric such as OCP, AHB, or BVCI via a corresponding fabric-to-fabric bridge. Transactions between IP operatively coupled to the PCI-based fabric and IP in the ARM-based ecosystem are facilitated by applying applicable ordering and conversions operations via the fabric-to-fabric bridge and/or fabrics. For example, posted writes originating from IP coupled to the PCI-based fabric are converted to non-posted writes and serialized via the fabric-to-fabric bridge and forwarded to the ARM-based ecosystem.

Abstract: An embodiment integrates non-PCI compliant devices with PCI compliant operating systems. A fabric system mimics the behavior of PCI. When non-PCI compliant devices do not know how to respond to PCI enumeration, embodiments provide a PCI enumeration reply and thus emulate a reply that would typically come from a PCI compliant device during emulation. Embodiments allow system designers to incorporate non-standard fabric structures with the benefit of still using robust and mature PCI infrastructure found in modern PCI compliant operating systems. More generally, embodiments allow an operating system compliant with a first standard (but not a second standard) to discover and communicate with a device that is non-compliant with the first standard (but possibly is compliant with the second standard). Other embodiments are described herein.

Abstract: An embodiment integrates non-PCI compliant devices with PCI compliant operating systems. A fabric system mimics the behavior of PCI. When non-PCI compliant devices do not know how to respond to PCI enumeration, embodiments provide a PCI enumeration reply and thus emulate a reply that would typically come from a PCI compliant device during emulation. Embodiments allow system designers to incorporate non-standard fabric structures with the benefit of still using robust and mature PCI infrastructure found in modem PCI compliant operating systems. More generally, embodiments allow an operating system compliant with a first standard (but not a second standard) to discover and communicate with a device that is non-compliant with the first standard (but possibly is compliant with the second standard). Other embodiments are described herein.

Abstract: Methods and apparatus for integrating ARM-based IPs in computer system employing PCI-based fabrics. An PCI-based fabric is operatively coupled to an ARM-based ecosystem employing an ARM-based fabric such as OCP, AHB, or BVCI via a corresponding fabric-to-fabric bridge. Transactions between IP operatively coupled to the PCI-based fabric and IP in the ARM-based ecosystem are facilitated by applying applicable ordering and conversions operations via the fabric-to-fabric bridge and/or fabrics. For example, posted writes originating from IP coupled to the PCI-based fabric are converted to non-posted writes and serialized via the fabric-to-fabric bridge and forwarded to the ARM-based ecosystem.

Abstract: An embodiment integrates non-PCI compliant devices with PCI compliant operating systems. A fabric system mimics the behavior of PCI. When non-PCI compliant devices do not know how to respond to PCI enumeration, embodiments provide a PCI enumeration reply and thus emulate a reply that would typically come from a PCI compliant device during emulation. Embodiments allow system designers to incorporate non-standard fabric structures with the benefit of still using robust and mature PCI infrastructure found in modem PCI compliant operating systems. More generally, embodiments allow an operating system compliant with a first standard (but not a second standard) to discover and communicate with a device that is non-compliant with the first standard (but possibly is compliant with the second standard). Other embodiments are described herein.

Abstract: In some embodiments if a transaction is directed at existing hardware, then the transaction is directed to existing hardware. If the transaction is not directed at existing hardware, then the transaction is sent through a behavioral model. Other embodiments are described and claimed.

Abstract: A magnetic recording medium includes a substrate, a magnetic recording layer made of a Co alloy or a CoCr alloy, a seed layer disposed between the substrate and the magnetic recording layer, and an underlayer made of a binary alloy material having a B2 structure and disposed between the seed layer and the magnetic recording layer. The seed layer is made of a material comprising essentially of one of elements forming the binary alloy material of the underlayer.

Abstract: A magnetic recording medium is constructed to include a lower magnetic layer, a nonmagnetic spacer layer disposed on the lower magnetic layer, and an upper magnetic layer disposed on the nonmagnetic spacer layer, where the upper and lower magnetic layers are antiferromagnetically coupled. The lower magnetic layer comprises a stabilization layer and a lower enhancement layer disposed between the stabilization layer and the nonmagnetic spacer layer, and the stabilization layer and the lower enhancement layer are ferromagnetically exchange coupled. The stabilization layer and the lower enhancement layer are made of CoCr alloys such that a Pt content of the stabilization layer is higher than that of the lower enhancement layer.