Patents by Inventor B. Chen

B. Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070128869
    Abstract: A method and apparatus for annealing copper. The method comprises forming a copper layer by electroplating on a substrate in an integrated processing system and annealing the copper layer in a chamber inside the integrated processing system.
    Type: Application
    Filed: February 2, 2007
    Publication date: June 7, 2007
    Inventors: B. Chen, Ho Shin, Yezdi Dordi, Ratson Morad, Robin Cheung