Patents by Inventor Bérénice REMY

Bérénice REMY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Permeable materials capable of lightning strike protection and use thereof in resin infusion processing
    Patent number: 11919274
    Abstract: A permeable LSP material that can be incorporated into a resin infusion process such as RTM and VaRTM. This permeable LSP material may be in the form of an elongated or continuous tape that can be used in an automated placement process such as ATL and AFP. In one embodiment, the permeable LSP material includes at least the following components: (a) a nonwoven veil of randomly arranged fibers; (b) a porous electrically conductive layer having openings through its thickness; and (c) a resin material distributed, in a non-continuous manner, throughout the nonwoven veil 11 and between the nonwoven veil and the porous conductive layer. The permeable LSP material can be brought into contact with a dry preform, followed by resin infusion and curing to form a hardened composite part having the LSP material integrated therein.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: March 5, 2024
    Assignee: CYTEC INDUSTRIES INC.
    Inventors: Bérénice Remy, Junjie Jeffrey Sang, Samuel J. Hill, Carmelo Luca Restuccia
  • PERMEABLE MATERIALS CAPABLE OF LIGHTNING STRIKE PROTECTION AND USE THEREOF IN RESIN INFUSION PROCESSING
    Publication number: 20200307162
    Abstract: A permeable LSP material that can be incorporated into a resin infusion process such as RTM and VaRTM. This permeable LSP material may be in the form of an elongated or continuous tape that can be used in an automated placement process such as ATL and AFP. In one embodiment, the permeable LSP material includes at least the following components: (a) a nonwoven veil of randomly arranged fibers; (b) a porous electrically conductive layer having openings through its thickness; and (c) a resin material distributed, in a non-continuous manner, throughout the nonwoven veil 11 and between the nonwoven veil and the porous conductive layer. The permeable LSP material can be brought into contact with a dry preform, followed by resin infusion and curing to form a hardened composite part having the LSP material integrated therein.
    Type: Application
    Filed: March 27, 2020
    Publication date: October 1, 2020
    Inventors: Bérénice REMY, Junjie Jeffrey SANG, Samuel J. HILL, Carmelo Luca RESTUCCIA