Abstract: An apparatus was described which allows accurate and fast positioning of device kits for the input shuttle, the output shuttle, the docking plates, hot plate and testing stations within the semiconductor device manufacturing and testing applications for Ball Grid Array sockets. A method was highlighted by means of which the sockets in these shuttles and plates can be adapted to different sizes and different types of semiconductor devices. A pick up shaft described resulted in added flexibility within the semiconductor device manufacturing and testing environment.

Abstract: An apparatus for effecting a semiconductor device handling method which includes picking up a semiconductor device by vacuum at the tip of a sleeve assembly nozzle having a longitudinal axis situated parallel to a Z axis of an orthogonal XYZ coordinate system and being movable in X and Y directions laterally of the Z axis in order to translate the sleeve assembly nozzle between different pick-up sites and a test site, and placing the semiconductor device onto a test contactor for testing, the improvements include means, operatively associated with the sleeve assembly nozzle, for adjusting the tip relative to a top surface of the semiconductor device and means, operatively associated with the sleeve assembly nozzle, for controlling the semiconductor device contact pressure by the mechanical arrangement of device members of the sleeve assembly nozzle.