Abstract: A light source unit not only applies red light and infrared light to promote immediate cellular activity, but also applies the light to a femoral epiphysis area (first area) and a tibial epiphysis area (second area) together so that a stimulating device for a growth plate includes a light source unit that directly emits light of 600 to 1100 nm to a femoral epiphysis area (first area) and a tibial epiphysis area (second area) where the growth plates are distributed.

Abstract: A light source unit not only applies red light and infrared light to promote immediate cellular activity, but also applies the light to a femoral epiphysis area (first area) and a tibial epiphysis area (second area) together so that a stimulating device for a growth plate includes a light source unit that directly emits light of 600 to 1100 nm to a femoral epiphysis area (first area) and a tibial epiphysis area (second area) where the growth plates are distributed.

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, the method including: preparing a base substrate having an insulating layer and a connection pad formed in the insulating layer; forming a photosensitive resist on the insulating layer; forming an opening part of which a side surface has a foot shape by patterning the photosensitive resist; forming a via hole exposing the connection pad by etching the insulating layer exposed by the opening part; and forming a via by filling the via hole.

Abstract: A semiconductor device includes a first metal wiring which is formed over substructure; a first contact plug which is coupled to the first metal wiring and passes through a first interlayer insulating film provided over the substructure; a second metal wiring which is provided over the first interlayer insulating film and is coupled to the first contact plug; a second contact plug which is coupled to the second metal wiring and passes through a second interlayer insulating film which is provided over the first interlayer insulating film; and a fuse pattern and a data read fuse pattern which are coupled to the second contact plug and provided over the second interlayer insulating film.

Abstract: A semiconductor device includes a first metal wiring which is formed over substructure; a first contact plug which is coupled to the first metal wiring and passes through a first interlayer insulating film provided over the substructure; a second metal wiring which is provided over the first interlayer insulating film and is coupled to the first contact plug; a second contact plug which is coupled to the second metal wiring and passes through a second interlayer insulating film which is provided over the first interlayer insulating film; and a fuse pattern and a data read fuse pattern which are coupled to the second contact plug and provided over the second interlayer insulating film.