Abstract: A system for testing multiple devices includes a connector holder having a plurality of holes, wherein each hole included in the plurality of holes is configured to hold a respective cable connector that connects to a cable; a device holder that is configured to hold a first device in a testing position; and an engagement mechanism that supports the connector holder and is operable to move the connector holder to an engaged position, wherein when the first device is being held by the device holder in the testing position, and a first hole included in the plurality of holes holds a first cable connector, a contact point associated with the first cable connector contacts a signal pad associated with the first device.

Abstract: This disclosure provides a multi-layered printed circuit board (PC) that has signal array region. The signal array region has a width and circumscribes a power core region and has signal vias connected to respective signal ball pads, and ground vias connected to respective ground ball pads within the signal array region that have an associated ball pad pitch. The PCB also has an inner current power layer. The signal and ground vias are arranged on the component layer in a pattern and extend into the inner current layer. The pattern forms current power paths across the width of the signal array region, such that the current power paths have a width that is at least about 50% as wide as the ball pad pitch.

Abstract: This disclosure provides a multi-layered printed circuit board (PC) that has signal array region. The signal array region has a width and circumscribes a power core region and has signal vias connected to respective signal ball pads, and ground vias connected to respective ground ball pads within the signal array region that have an associated ball pad pitch. The PCB also has an inner current power layer. The signal and ground vias are arranged on the component layer in a pattern and extend into the inner current layer. The pattern forms current power paths across the width of the signal array region, such that the current power paths have a width that is at least about 50% as wide as the ball pad pitch.