Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

Abstract: An apparatus, system and method for providing a floating end effector for grasping small precision parts. The end effector includes at least one end effector module having at least: tooling for grasping a part for pickup and placement; a module shaft connected on a first end to the tooling, and having a second end opposite the tooling; and at least two air bearing associated with the second end, wherein the at least two air bearings in combination impart degrees of freedom to the tooling in at least x and y axes and in theta.

Abstract: An apparatus, system and method for providing an automated contact cutter. The contact cutter includes a contact reel holder for holding therein a bandoleer comprising a plurality of stamped contacts; at least an inlet roller comprising an inlet pin, a turn roller, and a receiving roller mechanically connected by at least one motor drive belt to a drive motor, wherein the inlet roller is capable of receiving an end portion of the bandoleer onto the inlet pin for loading; a cutter between the turn roller and the receiving roller that is capable of cutting ones of the stamped contacts from the bandoleer for picking by a pick and place robot; and a comb capable of combing at least the bandoleer and cut and partially cut ones of the stamped contacts.

Abstract: An apparatus, system and method for providing a clamping system for a part associated with a pallet. The apparatus, system and method may include: two opposing jaws on the pallet, each comprising a gripper for gripping the part, and a jaw base. The jaw base may include: gearing that synchronizes actuation of the opposing jaws; and a roller distal from the gripper. The part-clamp may also include: a centering spring that compresses to put pressure against the other of the opposing jaws; and a cam off the pallet, comprising a cam shaft that drives a cam face into the rollers to actuate the two grippers.

Abstract: An apparatus, system and method for providing a variable swath end effector. The variable swath end effector may include: two arms, each for retaining a portion of a retained element; two pairs of bearing rails, each pair being uniquely mechanically associated with a one of the two arms, wherein a level of one pair of bearing rails is staggered from a second level of the other pair of earing rails in a perpendicular axis, and wherein the staggered pairs of bearing rails are interleaved with each other; and a motor capable of driving a belt in mechanical association with each of the two arms, wherein actuation of the motor drives the belt to synchronously move each of the two arms across a respective one of the pairs of bearing rails to vary the swath between the two arms.

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

Abstract: The disclosure provides an apparatus, system and method for a moveable bearing stage that allows for highly refined alignment and placement, and particularly planar alignment and placement, of component or devices through the use of robotics.

Abstract: The disclosure provides an apparatus, system and method for a moveable bearing stage that allows for highly refined alignment and placement, and particularly planar alignment and placement, of component or devices through the use of robotics.

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

Abstract: The disclosure provides an apparatus, system and method for a moveable bearing stage that allows for highly refined alignment and placement, and particularly planar alignment and placement, of component or devices through the use of robotics.

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

Abstract: The disclosure provides an apparatus, system and method for a moveable bearing stage that allows for highly refined alignment and placement, and particularly planar alignment and placement, of component or devices through the use of robotics.

Abstract: An apparatus, system and method for providing a Bernoulli-based wafer pre-aligner. The pre-aligner may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; and a plurality of Bernoulli pads on the wafer support for providing an interface between the wafer support and a one of the semiconductor wafers, wherein the interface comprises a gap there between.

Abstract: An apparatus, system and method for providing a Bernoulli-based wafer pre-aligner. The pre-aligner may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; and a plurality of Bernoulli pads on the wafer support for providing an interface between the wafer support and a one of the semiconductor wafers, wherein the interface comprises a gap there between.

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.

Abstract: The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.