Patents by Inventor Back Ki Sung

Back Ki Sung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting device
    Patent number: 9447956
    Abstract: A light emitting device includes at least one light emitting unit configured to emit light, a body unit supporting the at least one light emitting unit, and a support unit disposed on the body unit defining a light emitting position of the at least one light emitting unit. The support unit has a conical shape and is configured to support the at least one light emitting unit.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: September 20, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong Wook Kim, Back Ki Sung
  • LIGHT EMITTING DEVICE
    Publication number: 20140119016
    Abstract: A light emitting device includes at least one light emitting unit configured to emit light, a body unit supporting the at least one light emitting unit, and a support unit disposed on the body unit defining a light emitting position of the at least one light emitting unit. The support unit has a conical shape and is configured to support the at least one light emitting unit.
    Type: Application
    Filed: November 1, 2013
    Publication date: May 1, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong Wook KIM, Back Ki SUNG
  • PB FREE SOLDER ALLOY
    Publication number: 20090129970
    Abstract: The present invention relates to a solder alloy used for mounting or plating electronic components on a printed circuit board (PCB) and the like, and, more particularly, to a Pb-free Sn—Ag based solder alloy which comprises 0.1˜3.0 wt % of Cu, 0.01˜0.5 wt % of Ni, 0.01˜5.0 wt % of Ag, and the balance of Sn. The Pb-free Sn—Ag based solder alloy of the invention has a lower melting point, and highly enhanced wettability and joining strength, compared with the conventional Pb-free solder alloy, thereby preventing generation of bridges.
    Type: Application
    Filed: February 2, 2005
    Publication date: May 21, 2009
    Inventor: Back Ki Sung