Patents by Inventor Bae Doo Kim

Bae Doo Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SINGULATION METHOD USED IN LEADLESS PACKAGING PROCESS
    Publication number: 20020197826
    Abstract: A singulation method comprising: (a) providing a molded product including semiconductor chips attached and electrically coupled to an upper surface of a lead frame wherein a lower surface of the lead frame is exposed from the bottom of the molded product, the lead frame including a plurality of units in an array arrangement and cutting streets between the units, each unit having a die pad and leads arranged at the periphery of the die pad, a first metal layer formed on the entire lower surface of the lead frame except the cutting streets; (b) etching the lower surface of the lead frame with the first metal layer as mask such that the cutting streets are etched away to form a plurality of grooves; and (c) cutting the etched molded product along the grooves to obtain the leadless semiconductor packages.
    Type: Application
    Filed: August 14, 2001
    Publication date: December 26, 2002
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hyeongno Kim, Hyung Jun Park, Sangbae Park, Junhong Lee, Kun-A Kang, Bae Doo Kim
  • Singulation method used in leadless packaging process
    Patent number: 6489218
    Abstract: A singulation method comprising: (a) providing a molded product including semiconductor chips attached and electrically coupled to an upper surface of a lead frame wherein a lower surface of the lead frame is exposed from the bottom of the molded product, the lead frame including a plurality of units in an array arrangement and cutting streets between the units, each unit having a die pad and leads arranged at the periphery of the die pad, a first metal layer formed on the entire lower surface of the lead frame except the cutting streets; (b) etching the lower surface of the lead frame with the first metal layer as mask such that the cutting streets are etched away to form a plurality of grooves; and (c) cutting the etched molded product along the grooves to obtain the leadless semiconductor packages.
    Type: Grant
    Filed: August 14, 2001
    Date of Patent: December 3, 2002
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Hyeongno Kim, Hyung Jun Park, Sangbae Park, Junhong Lee, Kun-A Kang, Bae Doo Kim