Patents by Inventor Bae-Gun JUNG

Bae-Gun JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11521954
    Abstract: Disclosed is a light emitting diode (LED) assembly having vertical type micro LEDs which are vertically aligned and is capable of significantly improving light efficiency, a light quantity, and an integration degree through optimized alignment of the vertical type micro LEDs each having a nano size or micro size. The LED assembly includes a substrate provided with a plurality of through holes formed in a thickness direction, micro LEDs each formed in a vertical type in which a vertical width is greater than a lateral width, and aligned in an upright state by being at least partially inserted into the through holes, and a first electrode deposited on a lower surface of the substrate to be connected to a first conductive layer and a second electrode deposited on an upper surface of the substrate to be connected to a second conductive layer.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: December 6, 2022
    Inventors: Chi-Young Yoon, Bae-Gun Jung
  • Patent number: 11289460
    Abstract: Disclosed is a vertical alignment method of a micro light emitting diode (LED), which is capable of vertically aligning vertical type micro LEDs each having a nano size or micro size and stably maintaining an aligned state on a structural basis. The method includes preparing a substrate provided with a plurality of through holes formed in a thickness direction, locating micro LEDs to be aligned on the substrate in a state of being included in a suspension which provides buoyancy, and generating a pressure difference between an upper side and a lower side of the substrate and moving the suspension in a downward direction through the through holes of the substrate to induce the micro LEDs included in the suspension to be aligned in an upright state by being at least partially inserted into the through holes.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: March 29, 2022
    Inventors: Chi-Young Yoon, Bae-Gun Jung
  • Publication number: 20210098431
    Abstract: Disclosed is a light emitting diode (LED) assembly having vertical type micro LEDs which are vertically aligned and is capable of significantly improving light efficiency, a light quantity, and an integration degree through optimized alignment of the vertical type micro LEDs each having a nano size or micro size. The LED assembly includes a substrate provided with a plurality of through holes formed in a thickness direction, micro LEDs each formed in a vertical type in which a vertical width is greater than a lateral width, and aligned in an upright state by being at least partially inserted into the through holes, and a first electrode deposited on a lower surface of the substrate to be connected to a first conductive layer and a second electrode deposited on an upper surface of the substrate to be connected to a second conductive layer.
    Type: Application
    Filed: April 15, 2020
    Publication date: April 1, 2021
    Inventors: Chi-Young YOON, Bae-Gun JUNG
  • Publication number: 20210098430
    Abstract: Disclosed is a vertical alignment method of a micro light emitting diode (LED), which is capable of vertically aligning vertical type micro LEDs each having a nano size or micro size and stably maintaining an aligned state on a structural basis. The method includes preparing a substrate provided with a plurality of through holes formed in a thickness direction, locating micro LEDs to be aligned on the substrate in a state of being included in a suspension which provides buoyancy, and generating a pressure difference between an upper side and a lower side of the substrate and moving the suspension in a downward direction through the through holes of the substrate to induce the micro LEDs included in the suspension to be aligned in an upright state by being at least partially inserted into the through holes.
    Type: Application
    Filed: April 15, 2020
    Publication date: April 1, 2021
    Inventors: Chi-Young YOON, Bae-Gun JUNG