Patents by Inventor Bae-Mook Jeong
Bae-Mook Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240098880Abstract: The present disclosure relates to an electronic device, and more specifically, to an electronic device including a printed circuit board including a heat-generating element arranged on one surface thereof, and a heat transfer coin provided such that one surface of the heat transfer coin comes into contact with a portion of the other surface of the printed circuit board, opposite to the heat-generating element, so as to dissipate heat generated from the heat-generating element. Accordingly, the present disclosure provides an advantage of improving heat dissipation performance without increasing the thickness of the printed circuit board.Type: ApplicationFiled: December 1, 2023Publication date: March 21, 2024Applicant: KMW INC.Inventors: Bae Mook JEONG, Kyo Sung JI, Seong Min AHN, Chi Back RYU, Jae Eun KIM, Seung Min LEE, Ki Hun PARK, Won Jun PARK, Jun Woo YANG
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Publication number: 20240098885Abstract: A communication apparatus is provided to include an apparatus enclosure that includes a substrate seating surface and at least one or more connection grooves formed on the substrate seating surface, a first printed circuit board disposed on the substrate seating surface, a second printed circuit board disposed on the substrate seating surface on one side of the first printed circuit board, and at least one or more connectors disposed within the connection groove and configured to electrically connect the first printed circuit board and the second printed circuit board.Type: ApplicationFiled: December 1, 2023Publication date: March 21, 2024Applicant: KMW INC.Inventors: Bae Mook JEONG, Kyo Sung JI, Seong Min AHN, Chi Back RYU, Jae Eun KIM, Seung Min LEE, Ki Hun PARK, Won Jun PARK, Duk Yong KIM
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Patent number: 11936417Abstract: The present invention relates to a time-division duplex (TDD) antenna apparatus which can reduce signal loss, and thereby minimize the noise figure (NF) of a system and extend uplink coverage of the system, by separating a transmitter circuit from a receiver circuit of the antenna apparatus, and disposing a low noise amplifier (LNA) of the receiver circuit between a reception antenna and a reception filter of the receiver. A time-division duplex antenna apparatus according to an embodiment of the present invention includes: a transmitter which includes at least one transmission antenna module and transmits a downlink signal through a first path; a receiver which includes at least one reception antenna module and receives an uplink signal through a second path that is separated from the first path without any overlapping portions thereof; and a controller which controls the transmitter and the receiver in a time-division duplex manner.Type: GrantFiled: December 2, 2021Date of Patent: March 19, 2024Assignee: KMW INC.Inventors: Duk Yong Kim, Min Seon Yun, Bae Mook Jeong, Chang Seob Choi, Su Won Lee
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Publication number: 20240088553Abstract: The present invention relates to a signal shielding apparatus and an antenna apparatus including same, and in particular, comprises a shield cover which is stacked and disposed on a printed board assembly (hereinafter, abbreviated to “PBA”), in which a plurality of signal-related components are mounted on one side thereof to prevent leakage of a signal from the plurality of signal-related components, wherein a grooved shield cover seating groove is formed in one surface of the PBA, and an insertion end insertably seated in the shield cover seating groove is integrally formed in the other surface from among one surface and the other surface of the shield cover, the other surface facing the one surface of the PBA, thereby providing advantages in that an increase in the manufacturing cost may be prevented, EMI shielding may be facilitated, and heat dissipation performance may be significantly improved.Type: ApplicationFiled: November 24, 2023Publication date: March 14, 2024Applicant: KMW INC.Inventors: Duk Yong KIM, Bae Mook JEONG, Kyo Sung JI, Chi Back RYU, Won Jun PARK, Jun Woo YANG, Seong Min AHN, Ki Hun PARK, Jae Eun KIM
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Patent number: 11888207Abstract: An antenna apparatus is disclosed, including a lower housing, a middle housing disposed on the lower housing and having one surface formed with one or more first heat dissipation fins, a first accommodation space formed by the lower housing and the middle housing, at least one first heat-generating element disposed in the first accommodation space, one or more heat dissipation supports each disposed on the middle housing and having at least one surface formed with one or more second heat dissipation fins, and an antenna module supported on the one or more heat dissipation supports.Type: GrantFiled: December 19, 2021Date of Patent: January 30, 2024Assignee: KMW INC.Inventors: Kyo Sung Ji, Chang Woo Yoo, Bae Mook Jeong, Min Seon Yun, Jin Soo Yeo
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Patent number: 11831364Abstract: Provided is a multiple-input multiple-output (MIMO) antenna having a lightweight stacked structure. According to one aspect of the present invention, there is provided a MIMO antenna assembly having a lightweight stacked structure, in which a calibration network, which was provided between antenna elements and filters in the related art, is provided on one printed circuit board (PCB), together with a power amplifier and a digital circuit, and filters are closely coupled to the bottom of the PCB on which the feeding network is provided. The present invention employs a strategy in which an antenna assembly is reduced to a compact size while managing phase deviation caused due to filters at an acceptable level.Type: GrantFiled: July 4, 2021Date of Patent: November 28, 2023Assignee: KMW INC.Inventors: Duk Yong Kim, Bae Mook Jeong, Chang Woo Yoo, Young Chan Moon, Nam Shin Park, Bum Sik Park, Min Seon Yun, Min Sik Park, Sung Ho Jang
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Publication number: 20230344109Abstract: Proposed are an antenna RF module and an antenna apparatus including the antenna RF modules. The antenna RF module includes an amplification unit module which is arranged between a main board and an RF filter and into which at least one analog amplification element is built.Type: ApplicationFiled: June 28, 2023Publication date: October 26, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Young Chan MOON, Joon Hyong SHIM, Sung Hwan SO, Bae Mook JEONG, Min Seon YUN, Kyo Sung JI, Chi Back RYU, Sung Ho JANG, Jae Hong KIM, Oh Seog CHOI, Yong Won SEO
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Publication number: 20230327327Abstract: The present disclosure relates to an antenna apparatus, and especially comprises: a main body module in which a main board is mounted; an RF module which is fixed to the front so that an intermediate outside air layer is formed between the RF module and the main body module, and in which an RF filter unit and an antenna element unit are mounted; and an amplification unit module which is disposed so as to be exposed in the intermediate outside air layer between the main body module and the RF module, and comprises an amplification unit substrate having analog amplification elements mounted thereon, wherein heat generated from heating elements mounted on the main board is dissipated through at least any one of the front and back of the main body module, and heat generated from the amplification unit module is directly dissipated through the intermediate outside air layer, and thus the advantage of enabling maximum heat dissipation performance is provided.Type: ApplicationFiled: June 1, 2023Publication date: October 12, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Young Chan MOON, Joon Hyong SHIM, Sung Hwan SO, Bae Mook JEONG, Min Seon YUN, Kyo Sung JI, Chi Back RYU, Sung Ho JANG, Jae Hong KIM, Oh Seog CHOI, Yong Won SEO, Won Jun PARK
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Publication number: 20230327345Abstract: Proposed are an antenna RF module and an antenna apparatus including the antenna RF modules. The antenna RF module includes an RF filter arranged on a front surface of a main board, a radiation element module arranged on a front surface of the RF filter, at least one reflector grill pin arranged between the RF filter and the radiation element module and grounding (GND) the radiation element module, outside air being introduced from in front of the RF filter to in back of the RF filter or being discharged from in back of the RF filter to in front of the RF filter through the at least one reflector grill pin, and a radome cover combined with the front surface of the RF filter and protecting the radiation element module from the outside. The antenna RF module provides the advantage of greatly improving overall performance in heat dissipation.Type: ApplicationFiled: June 8, 2023Publication date: October 12, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Young Chan MOON, Joon Hyong SHIM, Sung Hwan SO, Bae Mook JEONG, Min Seon YUN, Kyo Sung JI, Chi Back RYU, Sung Ho JANG, Jae Hong KIM, Oh Seog CHOI, Yong Won SEO
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Publication number: 20230299456Abstract: The present invention relates to an antenna RF module, an RF module assembly, and an antenna device including same. Particularly, the present invention comprises an RF filter which has at least four outer side surfaces, a radiation element module which is disposed on one surface of the outer side surfaces of the RF filter, an amplifier substrate which is disposed on another surface of the outer side surfaces of the RF filter and on which an analogue amplification element is mounted, and a reflector which is disposed between the RF filter and the radiation element module to ground (GND) the radiation element module and also mediate the outwardly dissipating heat generated by the RF filter, wherein socket pins are coupled to a main board disposed at an antenna housing in a unit of a module.Type: ApplicationFiled: April 19, 2023Publication date: September 21, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Joon Hyong SHIM, Sung Hwan SO, Bae Mook JEONG, Min Seon YUN, Kyo Sung JI, Chi Back RYU, Sung Ho JANG, Jae Hong KIM, Oh Seog CHOI, Yong Won SEO
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Publication number: 20230299021Abstract: Provided are a power amplification device and a manufacturing method thereof, wherein the power amplification device provides compact substrates by laminating a plurality of substrates, and has improved heat dissipating performance since a heat dissipating plate is installed to be in surface-contact with one of the plurality of substrates, and a heating element mounted on the substrate is in contact with the heat dissipating plate.Type: ApplicationFiled: April 21, 2023Publication date: September 21, 2023Applicant: KMW INC.Inventors: Bae Mook JEONG, Seong Min AHN, Jae Eun KIM, Seung Min LEE, Jin Soo YEO
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Publication number: 20230291117Abstract: The present disclosure relates to an antenna RF module and an antenna apparatus including the antenna RF modules. The antenna RF module includes an RF filter arranged on a front surface of a main board, a radiation element module arranged on a front surface of the RF filter, at least one reflector grill pin arranged between the RF filter and the radiation element module and grounding (GND) the radiation element module, outside air being introduced from in front of the RF filter to in back of the RF filter or being discharged from in back of the RF filter to in front of the RF filter through the at least one reflector grill pin, and a radome combined with the front surface of the RF filter and protecting the radiation element module from the outside.Type: ApplicationFiled: May 18, 2023Publication date: September 14, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Young Chan MOON, Nam Shin PARK, Sung Ho JANG, Jae Hong KIM, Joon Hyong SHIM, Bae Mook JEONG, Min Seon YUN, Seong Min AHN, Jae Eun KIM, Sung Hwan SO, Yong Won SEO, Oh Seog CHOI, Kyo Sung JI, Chi Back RYU
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Publication number: 20230282978Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. The antenna RF module includes an RF filter arranged on a front surface of a main board, a radiation element module arranged on a first side of the RF filter, and a reflector arranged between the RF filter and the radiation element module in such a manner as to ground (GND) the radiation element module and, at the same time, to serve as an intermediary for dissipating heat generated in the RF filter to the outside. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The advantage of greatly improving performance in heat dissipation can be achieved.Type: ApplicationFiled: April 23, 2023Publication date: September 7, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Young Chan MOON, Joon Hyong SHIM, Sung Hwan SO, Bae Mook JEONG, Min Seon YUN, Kyo Sung JI, Chi Back RYU, Sung Ho JANG, Jae Hong KIM, Oh Seog CHOI, Yong Won SEO
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Patent number: 11736156Abstract: Provided is a multiple-input multiple-output (MIMO) antenna having a lightweight stacked structure. According to one aspect of the present invention, there is provided a MIMO antenna assembly having a lightweight stacked structure, in which a calibration network, which was provided between antenna elements and filters in the related art, is provided on one printed circuit board (PCB), together with a power amplifier and a digital circuit, and filters are closely coupled to the bottom of the PCB on which the feeding network is provided. The present invention employs a strategy in which an antenna assembly is reduced to a compact size while managing phase deviation caused due to filters at an acceptable level.Type: GrantFiled: July 4, 2021Date of Patent: August 22, 2023Assignee: KMW INC.Inventors: Duk Yong Kim, Bae Mook Jeong, Chang Woo Yoo, Young Chan Moon, Nam Shin Park, Bum Sik Park, Min Seon Yun, Min Sik Park, Sung Ho Jang
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Publication number: 20230253695Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. Particularly, the antenna RF module includes an RF filter, a radiation element module arranged on a first side of the RF filter, and an amplification unit board arranged on a second side of the RF filter, an analog amplification element being mounted on the amplification unit board. A plurality of antenna RF modules constitute the RF module assembly, and the RF module assembly and an antenna housing constitute the antenna apparatus. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The effect of greatly improving performance in heat dissipation can be achieved.Type: ApplicationFiled: April 16, 2023Publication date: August 10, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Young Chan MOON, Nam Shin PARK, Sung Ho JANG, Jae Hong KIM, Joon Hyong SHIM, Bae Mook JEONG, Min Seon YUN, Sung Hwan SO, Yong Won SEO, Oh Seog CHOI, Kyo Sung JI, Chi Back RYU, Seong Min AHN, Jae Eun KIM
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Publication number: 20230253694Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. Particularly, the antenna RF module includes an RF module, a radiation element module arranged on a first side of the RF filter, and an amplification unit board arranged on a second side of the RF filter, an analog amplification element being mounted on the amplification unit board. A plurality of antenna RF modules constitute the RF module assembly, and the RF module assembly and an antenna housing constitute the antenna apparatus. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The effect of greatly improving performance in heat dissipation can be achieved.Type: ApplicationFiled: April 16, 2023Publication date: August 10, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Young Chan MOON, Nam Shin PARK, Sung Ho JANG, Jae Hong KIM, Joon Hyong SHIM, Bae Mook JEONG, Min Seon YUN, Sung Hwan SO, Yong Won SEO, Oh Seog CHOI, Kyo Sung JI, Chi Back RYU, Seong Min AHN, Jae Eun KIM
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Publication number: 20230253693Abstract: The present disclosure relates to an antenna RF module, an RF module assembly including the antenna RF modules, and an antenna apparatus including the RF module assembly. Particularly, the antenna RF module includes an RF module, a radiation element module arranged on a first side of the RF filter, and an amplification unit board arranged on a second side of the RF filter, an analog amplification element being mounted on the amplification unit board. A plurality of antenna RF modules constitute the RF module assembly, and the RF module assembly and an antenna housing constitute the antenna apparatus. Accordingly, a radome that interrupts dissipation of heat to in front of an antenna is unnecessary, and heat generated from heat generating elements of the antenna apparatus is spatially separated. Thus, it is possible that the heat is dissipated in a distributed manner toward the front and rear directions of the antenna apparatus. The effect of greatly improving performance in heat dissipation can be achieved.Type: ApplicationFiled: April 14, 2023Publication date: August 10, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Young Chan MOON, Nam Shin PARK, Sung Ho JANG, Jae Hong KIM, Joon Hyong SHIM, Bae Mook JEONG, Min Seon YUN, Sung Hwan SO, Yong Won SEO, Oh Seog CHOI, Kyo Sung JI, Chi Back RYU, Seong Min AHN, Jae Eun KIM
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Publication number: 20230109083Abstract: The present invention relates to relates to a multi-input and multi-output antenna apparatus, and particularly, to a multi-input and multi-output antenna apparatus including a main board having an accommodation space formed in at least one region and provided in the form of a predetermined space, and a sub-board stacked on a rear surface portion of the main board and configured such that a plurality of heating elements is mounted on a front surface portion of the sub-board that is directed toward the accommodation space, in which heat generated from the heating elements is dissipated to a rear surface portion of the sub-board, which makes it possible to improve heat dissipation performance of the antenna apparatus and improve frequency filtering performance of the antenna apparatus.Type: ApplicationFiled: December 5, 2022Publication date: April 6, 2023Applicant: KMW INC.Inventors: Duk Yong KIM, Kyo Sung JI, Chi Back RYU, Bae Mook JEONG
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Publication number: 20230085969Abstract: The present invention relates to an antenna device and, particularly, the antenna device comprises: a printed board assembly (hereinafter, referred to as “PBA”) having a plurality of antenna-related components mounted on one surface thereof, and having a plurality of filters mounted on the other surface thereof, an antenna board which is arranged to be stacked on one surface side of the PBA, and which has a plurality of antenna elements mounted on one surface thereof and connected to construct electrical signal lines with the filters in close contact with the other surface thereof, and clamshell units interposed between the other surface of the PBA and one surface of the filters to perform a signal shielding function, wherein the insides of the clamshell units include strip line connectors which absorb the assembly tolerance between the clamshell units while being partially deformed by means of the adhesion of the filters during close-coupling of the filters, and which shield a signal by means of ground surfaType: ApplicationFiled: November 22, 2022Publication date: March 23, 2023Applicant: KMW INC.Inventors: Kyo Sung JI, Bae Mook JEONG, Joung Hoe KIM
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Publication number: 20230090243Abstract: A PCB assembly is disclosed herein. An embodiment of the present disclosure provides a printed circuit board (PCB) assembly on which a plurality of devices is mounted, including: a power supply area disposed at one side of a main printed circuit board; a first area positioned in another direction of the main printed circuit board from the power supply area and including the plurality of devices; a second area positioned in another direction of the main printed circuit board from the first area and including the plurality of devices; a third area positioned in another direction of the main printed circuit board from the second area and including the plurality of devices; and a bridge printed circuit board receiving power from the power supply area and disposed vertically to the main printed circuit board, wherein the bridge printed circuit board crosses the first area, the second area, and the third area, and transmits power and a signal to at least one area.Type: ApplicationFiled: November 25, 2022Publication date: March 23, 2023Applicant: KMW INC.Inventors: Kyo Sung JI, Chi Back RYU, Bae Mook JEONG, Min Seon YUN